List of Intel Atom microprocessors

Short description: Wikipedia list article

Main article: Engineering:Intel Atom

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The Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.

For Nettop and Netbook Atom Microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

## Contents

* 1 Nettop processors (small desktop)
* 1.1 Bonnell microarchitecture
* 1.1.1 "Diamondville" (45 nm)
* 1.1.2 "Pineview" (45 nm)
* 1.1.3 "Cedarview" (32 nm)
* 2 Netbook processors (sub-notebook)
* 2.1 Bonnell microarchitecture
* 2.1.1 "Diamondville" (45 nm)
* 2.1.2 "Pineview" (45 nm)
* 2.1.3 "Cedarview" (32 nm)
* 3 MID processors/SoCs (UMPC/Smartphone/IoT)
* 3.1 Bonnell microarchitecture
* 3.1.1 "Silverthorne" (45 nm)
* 3.1.2 "Lincroft" (45 nm)
* 3.1.3 "Penwell" (32 nm)
* 3.2 Silvermont microarchitecture
* 3.2.1 "Merrifield" (22 nm)
* 3.2.2 "Moorefield" (22 nm)
* 3.2.3 "SoFIA" (28 nm)
* 4 Tablet processors/SoCs
* 4.1 Bonnell microarchitecture
* 4.1.1 "Lincroft" (45 nm)
* 4.1.2 "Cloverview" (32 nm)
* 4.2 Silvermont microarchitecture
* 4.2.1 "Bay Trail-T" (22 nm)
* 4.3 Airmont microarchitecture
* 4.3.1 "Cherry Trail-T" (14 nm)
* 5 Embedded processors/SoCs
* 5.1 Bonnell microarchitecture
* 5.1.1 "Tunnel Creek" (45 nm)
* 5.1.2 "Stellarton" (45 nm)
* 5.2 Silvermont microarchitecture
* 5.2.1 "Bay Trail-I" (22 nm)
* 5.3 Airmont microarchitecture
* 5.3.1 "Braswell" (14 nm)
* 5.4 Goldmont microarchitecture
* 5.4.1 "Apollo Lake" (14 nm)
* 5.5 Tremont microarchitecture
* 5.5.1 "Elkhart Lake" (10 nm SuperFin)
* 6 Server SoCs
* 6.1 Bonnell microarchitecture
* 6.1.1 "Centerton" (32 nm)
* 6.1.2 "Briarwood" (32 nm)
* 6.2 Silvermont microarchitecture
* 6.2.1 "Avoton" (22 nm)
* 6.2.2 "Rangeley" (22 nm)
* 6.3 Goldmont microarchitecture
* 6.3.1 "Denverton" (14 nm)
* 6.4 Tremont microarchitecture
* 6.4.1 "Snow Ridge" (10 nm)
* 7 CE SoCs
* 7.1 Single-core CE SoCs
* 7.1.1 "Sodaville" (45 nm)
* 7.1.2 "Groveland" (45 nm)
* 7.2 Dual-Core CE SoCs
* 7.2.1 "Berryville" (32 nm)
* 8 See also
* 9 References
* 10 External links

## Nettop processors (small desktop)

### Bonnell microarchitecture

#### "Diamondville" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading
* Transistors: 47 million
* Die size: 25.96 mm² (3.27 × 7.94)
* Package size: 22 mm × 22 mm

#### "Pineview" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading
* Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller[1]
* Transistors: 123 million (single-core), 176 million (dual-core)
* Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core)
* Package size: 22 mm × 22 mm

#### "Cedarview" (32 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading (D2550, D2560, D2700, D2701[2] only)
* Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller[3]
* Package size: 22 mm × 22 mm

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## Netbook processors (sub-notebook)

### Bonnell microarchitecture

#### "Diamondville" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
* Transistors: 47 million
* Die size: 26 mm²
* Package size: 22 mm × 22 mm

#### "Pineview" (45 nm)

Intel Atom N455

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
* Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB[4]
* Transistors: 123 million (single-core), 176 million (dual-core)
* Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core)
* Package size: 22 mm × 22 mm

#### "Cedarview" (32 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
* Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller[5]
* Package size: 22 × 22 mm

## MID processors/SoCs (UMPC/Smartphone/IoT)

### Bonnell microarchitecture

#### "Silverthorne" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
* Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
* Model Z515 supports Intel Burst Performance Technology
* Uses the Poulsbo chipset.
* Transistors: 47 million
* Die size: 26 mm²
* Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number)

#### "Lincroft" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).
* GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.[6]
* Transistors: 140 million
* Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
* Package size: 13.8 mm × 13.8 × 1.0 mm
* Steppings: C0

#### "Penwell" (32 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading.
* Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller
* Package size: 12 mm × 12 × 1.0 mm

### Silvermont microarchitecture

#### "Merrifield" (22 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT).
* Z3480 also supports Intel Wireless Display.
* Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
* Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
* Package size: 12 mm × 12 × 1.0 mm

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#### "Moorefield" (22 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Display.
* GPU (PowerVR G6430) and memory controller are integrated onto the processor die
* Package size: 14 mm × 14 × 1.0 mm

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#### "SoFIA" (28 nm)

* SoFIA (smart or feature phone with Intel architecture)[7]
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI (based on Silvermont's specs)
* GPU (ARM Mali) and memory controller are integrated onto the processor die
* Package size: 34 × 40 mm
* SoFIA 3G SoC with Silvermont CPU
* Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)[8]
* SoFIA 3G–R SoC with Silvermont CPU
* Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK)[9]
* SoFIA LTE (W) with Airmont CPU (Announced, but never launched)
* Integrated LTE Cat. 4 (XG726-based), SMARTi™ 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)[10]

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## Tablet processors/SoCs

### Bonnell microarchitecture

#### "Lincroft" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).
* GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die[11]
* Transistors: 140 million
* Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
* Package size: 13.8 mm × 13.8 × 1.0 mm
* Steppings: C0

#### "Cloverview" (32 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading, Intel Burst Performance Technology (BPT).
* GPU and memory controller are integrated onto the processor die
* Package size: 13.8 mm × 13.8 × 1.0 mm
* Steppings:B1, C0

|} No official TDP available. For power data see [12] page 129-130.

### Silvermont microarchitecture

#### "Bay Trail-T" (22 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI, TXT/TXE
* Package size: 17 mm × 17 × 1.0 mm

Type 4 SoC:[13]

* DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
* Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
* Integrated Intel HD Graphics (Gen7) GPU
* One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
* One USB 2.0 controller supporting four ports
* Integrated LPE audio controller
* Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and steroscopic video
* Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
* Serial I/O supporting SPI, UART (serial port), I2C or PWM

Type 3 SoC:

* DDR3L/L-RS single-channel memory controller supporting up to 2 GB
* Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4)
* Integrated Intel HD Graphics (Gen7) GPU
* One USB controller supporting two USB 2.0 ports
* Integrated LPE audio controller
* Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
* Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
* Serial I/O supporting SPI, UART (serial port), I2C or PWM

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### Airmont microarchitecture

#### "Cherry Trail-T" (14 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x2 (VT-x with EPT, FlexMigration, FlexPriority and VPID[14][15]), AES-NI.[16], TXT/TXE
* Package size: 17 mm × 17 × 1.0 mm

Type 4 SoC:[17]

* LPDDR3 dual-channel memory controller supporting up to 8 GB
* PCI Express 2.0 controller with 2 lanes
* Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
* Integrated Intel HD Graphics (Gen8) GPU
* One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
* One USB xDCI controller supporting one USB 3.0 port
* Integrated LPE audio controller
* Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
* Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
* Serial I/O supporting SPI, UART (serial port), I2C or PWM

Type 3 SoC:

* DDR3L/L-RS single-channel memory controller supporting up to 2 GB
* PCI Express 2.0 controller with 1 lane
* Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
* Integrated Intel HD Graphics (Gen8) GPU
* One USB controller supporting three USB 2.0 ports and two HSIC ports
* Integrated LPE audio controller
* Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
* Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
* Serial I/O supporting SPI, UART (serial port), I2C or PWM

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## Embedded processors/SoCs

### Bonnell microarchitecture

#### "Tunnel Creek" (45 nm)

* CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), hyper-threading, Intel VT-x.
* Package size: 22 mm × 22 mm
* Steppings: B0
* Temperature range: for (E620, E640, E660, E680): 0°C to +70°C, for (E620T, E640T, E660T, E680T): -40°C to +85°C.
* DDR2 single-channel memory controller supporting up to 2 GB
* PCI Express 1.0a controller with 4 lanes
* Display controller with LVDS and serial DVO ports
* Integrated GMA600 (PowerVR) GPU
* Integrated HD audio controller
* Serial I/O supporting SPI

#### "Stellarton" (45 nm)

* "Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA)
* CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x
* Package size: 37.5 mm × 37.5 mm
* Steppings: B0
* TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
* Temperature range: for (E625C, E645C, E665C): 0°C to +70°C, for (E625CT, E645CT, E665CT): -40°C to +85°C.
* DDR2 single-channel memory controller supporting up to 2 GB
* PCI Express 1.0a controller with 4 lanes
* Display controller with LVDS and serial DVO ports
* Integrated GMA600 (PowerVR) GPU
* Integrated HD audio controller
* Serial I/O supporting SPI

### Silvermont microarchitecture

#### "Bay Trail-I" (22 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, TXT/TXE
* Package size: 25 mm × 27 mm
* DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
* Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
* Integrated Intel HD Graphics (Gen7) GPU
* PCI Express 2.0 controller with four lanes and four root ports
* Two SATA-300 ports
* One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
* One USB 2.0 controller supporting four ports
* Integrated LPE and HD audio controllers
* Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and steroscopic video
* Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC
* Serial I/O supporting SPI, UART (serial port), I2C or PWM

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### Airmont microarchitecture

#### "Braswell" (14 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
* GPU and memory controller are integrated onto the processor die
* GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
* Package size: 25 mm × 27 mm

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### Goldmont microarchitecture

#### "Apollo Lake" (14 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, TXT/TXE
* Package size: 24 mm × 31 mm
* DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC
* Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)
* Integrated Intel HD Graphics (Gen9) GPU
* PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally
* Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)
* Two USB 2.0 ports
* Two SATA-600 ports (one multiplexed with USB 3.0)
* Integrated HD audio controller
* Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
* Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
* Serial I/O supporting SPI, HSUART (serial port) and I2C

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### Tremont microarchitecture

#### "Elkhart Lake" (10 nm SuperFin)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
* GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI, DP, eDP, or DSI.
* SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.
* Package size: 35 mm × 24 mm

## Server SoCs

All Atom server processors include ECC support.

### Bonnell microarchitecture

#### "Centerton" (32 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

#### "Briarwood" (32 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

### Silvermont microarchitecture

#### "Avoton" (22 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64 (according to Datasheet), XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
* Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
* Quad-core SoC peripherals include 4 × USB 2.0, 2 (C2530) or 6 (C2550) × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
* C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
* C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
* Package size: 34 mm × 28 mm

#### "Rangeley" (22 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
* All models except C2x38 support Intel QuickAssist Technology (cryptography accelerator)
* SoC peripherals include 4 × USB 2.0, 4-6 × SATA (1 for C2308, 2 for C2316, C2508, C2516), 4 × Integrated GbE LAN (2 for C2316), 2 × UART, and 8-16 lanes of PCI Express 2.0 (4 lanes for C2308), in x16, x8, x4, x2, and x1 configurations.
* Package size: 34 mm × 28 mm

### Goldmont microarchitecture

#### "Denverton" (14 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost (dual-core, C3xx0, C3xx5 only), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, ECC memory.
* SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA, 4 × Integrated 1GbE, 2.5GbE, and 10GbE (C3538 and up) LAN, and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations.
* Package size: 34 mm × 28 mm

### Tremont microarchitecture

#### "Snow Ridge" (10 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
* Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores.
* SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100Gbps LAN, 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.
* Intel Dynamic Load Balancer(Intel DLB) & Intel QuickAssist Technology(Intel QAT)[18]
* Designed for base transceiver stations, especially that for 5G networks.
* Package size: 47.5 mm × 47.5 mm

## CE SoCs

For other earlier (not Atom branded) Intel CE SoCs, see Olo River (CE 2110) and Canmore (CE 3100).

### Single-core CE SoCs

#### "Sodaville" (45 nm)

[19]

* Package size: 27 mm × 27 mm
* GPU (based on the PowerVR SGX535 from Imagination Technologies)

#### "Groveland" (45 nm)

CE4200[20]

* Package size: ?? mm × ?? mm
* 2 × 32-bit memory channels, up to DDR2-800
* GPU (based on the PowerVR SGX535 from Imagination Technologies)

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### Dual-Core CE SoCs

#### "Berryville" (32 nm)

[21][22][23]

* Package size: ?? mm × ?? mm
* GPU for 3D (based on the PowerVR SGX545 from Imagination Technologies)
* GPU for 2D (GC300 from Vivante)

## See also

* Atom (system on chip)
* Comparison of Intel processors
* List of Intel Celeron microprocessors
* Intel GMA
* Stealey (microprocessor) (A100/A110)
* Geode (processor)
* VIA Nano
* Intel Quark
* Intel Edison

## References

1. ↑ https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/atom-d400-d500-vol-1-datasheet.pdf
2. ↑ Ganesh T S (11 November 2013). "Netgear ReadyNAS 312 2-bay SMB / SOHO NAS Review". Anandtech.com. http://www.anandtech.com/show/7500/netgear-readynas-312-2bay-smb-soho-nas-review/1.
3. ↑ https://www.intel.ca/content/dam/doc/datasheet/atom-d2000-n2000-vol-1-datasheet.pdf
4. ↑ https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/atom-n400-vol-1-datasheet-.pdf
5. ↑ https://www.intel.ca/content/dam/doc/datasheet/atom-d2000-n2000-vol-1-datasheet.pdf
6. ↑ https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/atom-z6xx-datasheet.pdf
7. ↑ https://www.theregister.co.uk/2016/02/23/move_over_continuum_intel_shows_android_smartphone_powering_bigscreen_linux/
8. ↑ Rockchip
9. ↑ Rockchip
10. ↑ Rockchip
11. ↑ https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/atom-z6xx-datasheet.pdf
12. ↑ https://www-ssl.intel.com/content/dam/www/public/us/en/documents/product-briefs/atom-z2760-datasheet.pdf
13. ↑ https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/atom-z36xxx-z37xxx-datasheet-vol-1.pdf
14. ↑ "What exactly is VT-x2?". Software.intel.com. 2009-03-30. https://software.intel.com/en-us/forums/topic/297516.
15. ↑ http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/virtualization-enabling-intel-virtualization-technology-features-and-benefits-paper.pdf
16. ↑ "Intel® Atom™ Processor Z8000 Series Datasheet, Vol. 1". Ssl.intel.com. https://www-ssl.intel.com/content/www/us/en/processors/atom/atom-z8000-datasheet-vol-1.html.
17. ↑ https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/atom-z36xxx-z37xxx-datasheet-vol-1.pdf
18. ↑ https://www.intel.com/content/www/us/en/architecture-and-technology/intel-quick-assist-technology-overview.html
19. ↑ Intel Atom Processor CE4100 Product Brief
20. ↑ Intel Unveils Atom CE4200
21. ↑ "New Choices for Consumers with Intel Silicon in Set-Top Boxes and Media Gateways". https://scoop.intel.com/new-choices-for-consumers-with-intel-silicon-in-set-top-boxes-and-media-gateways/.
22. ↑ Intel’s Berryville Atom CE processors revealed
23. ↑ Intel launches new CE5300 series media processors

## External links

* Intel Atom Processor - Overview
* SSPEC/QDF Reference (Intel)
* Intel Corporation - Processor Price List
* Intel Atom and VIA Nano performance compared
* Intel CPU Transition Roadmap 2008-2013
* Intel Desktop CPU Roadmap 2004-2011

* v
* t
* e

Intel processors

Discontinued

BCD oriented (4-bit)|

* 4004 (1971)
* 4040 (1974)

pre-x86 (8-bit)|

* 8008 (1972)
* 8080 (1974)
* 8085 (1977)

Early x86 (16-bit)|

* 8086 (1978)
* 8088 (1979)
* 80186 (1982)
* 80188 (1982)
* 80286 (1982)

x87 (external FPUs)|

8/16-bit databus
8087 (1980)
16-bit databus
80187
80287
80387SX
32-bit databus
80387DX
80487

IA-32 (32-bit)|

* 80386
* SX
* 376
* EX
* 80486
* SX
* DX2
* DX4
* SL
* RapidCAD
* OverDrive
* A100/A110
* Celeron (1998)
* M
* D (2004)
* Pentium
* Original P5
* OverDrive
* Pro
* II
* II OverDrive
* III
* 4
* M
* Dual-Core
* some Core
* Solo
* Duo
* Tolapai

x86-64 (64-bit)|

* Celeron
* D
* Dual-Core
* Pentium
* 4
* D
* Extreme Edition
* Dual-Core
* some Core
* 2
* some i7

Other|

CISC
iAPX 432
Itanium
RISC
i860
i960
StrongARM
XScale

Current

IA-32 (32-bit)|

* Atom
* CE
* SoC
* Quark

x86-64 (64-bit)|

* Atom
* CE
* SoC
* Celeron
* Pentium
* Core
* i3
* i5
* i7
* i9
* M
* Xeon
* E3
* E5
* E7
* D
* Phi

Lists

* Celeron
* Pentium
* Pro
* II
* III
* 4
* D
* M
* Core
* Core
* 2
* i3
* i5
* i7
* i9
* M
* Atom
* Xeon
* Itanium

Related

* Tick–tock model
* Chipsets
* GPUs
* GMA
* HD and Iris Graphics
* PCHs
* SCHs
* ICHs
* PIIXs
* Stratix
* Codenames

Microarchitectures

x86|

| P5|

800 nm

600 nm
P54C
350 nm
P54CS
P55C
250 nm
Tillamook

|

P6, Pentium M,
Enhanced Pentium M|

500 nm

350 nm

Klamath
250 nm
Mendocino
Dixon
Tonga
Covington
Deschutes
Katmai
Drake
Tanner
180 nm
Coppermine
Coppermine T
Timna
Cascades
130 nm
Tualatin
Banias
90 nm
Dothan
Stealey
Tolapai
Canmore
65 nm
Yonah
Sossaman

NetBurst|

180 nm
Willamette
Foster
130 nm
Northwood
Gallatin
Prestonia
90 nm
Tejas and Jayhawk
Prescott
Smithfield
Nocona
Irwindale
Cranford
Potomac
Paxville
65 nm
Cedar Mill
Presler
Dempsey
Tulsa

Core|

65 nm
Merom-L
Merom
Conroe-L
Allendale
Conroe
Kentsfield
Woodcrest
Clovertown
Tigerton

45 nm
Penryn
Penryn-QC
Wolfdale
Yorkfield
Wolfdale-DP
Harpertown
Dunnington

Nehalem|

45 nm
Auburndale
Beckton (Nehalem-EX)
Bloomfield
Clarksfield
Gainestown (Nehalem-EP)
Havendale
Jasper Forest
Lynnfield

32 nm
Arrandale
Clarkdale
Gulftown (Westmere-EP)
Westmere-EX

Sandy Bridge|

32 nm
Sandy Bridge
Sandy Bridge-E
Gladden

22 nm
Ivy Bridge
Ivy Bridge-EP
Ivy Bridge-EX

Haswell|

22 nm
Haswell

14 nm
Broadwell

Skylake|

14 nm
Skylake
Kaby Lake (Amber Lake • Whiskey Lake)
Coffee Lake
Cascade Lake
Comet Lake

Palm Cove|

10 nm
Cannon Lake

Sunny Cove|

14 nm
Cooper Lake

10 nm
Ice Lake

Willow Cove|

14 nm
Rocket Lake

10 nm
Tiger Lake
Sapphire Rapids

Golden Cove|

7 nm
Alder Lake
Granite Rapids

Atom|

| Bonnell
Saltwell|

45 nm
Silverthorne
Diamondville
Pineview
Lincroft
Tunnel Creek
Stellarton
Sodaville
Groveland

32 nm
Cedarview
Penwell
Cloverview
Berryville
Centerton

|

Silvermont
Airmont|

22 nm
Valleyview
Tangier
Anniedale

14 nm
Cherryview

Goldmont|

14 nm
Goldmont
Goldmont Plus

Tremont|

10 nm
Tremont
Gracemont

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