Winbond

Winbond Electronics Corporation
華邦電子公司Type| Corporation

|

Industry| Semiconductors
Founded| 1987; 39 years ago (1987)
Headquarters| Taichung, Taiwan

Key people

| Arthur Yu-Cheng Chiao
(Chairman & CEO)
Tung-Yi Chan
(President)
Products|

* Mobile DRAM
* Specialty DRAM
* Flash memory

Website| www.winbond.com
A Winbond Super I/O chip on a desktop PC motherboard A Winbond controller

Winbond Electronics Corporation (Chinese: 華邦電子公司; pinyin: Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.

## History

Winbond was established in 1987 in Hsinchu Science Park in Taiwan.[1][2] Its founder came from the Industrial Technology Research Institute.[3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant.[4]

In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers.[5]

Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995.[6]

Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing.[7] By 2002 Winbond had 4,000 employees.[1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.[8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM.[9]

In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda.[10]

In 2019 Karamba Security partnered with Winbond to make secure embedded flash products.[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.[12]

## See also

* List of semiconductor fabrication plants
* List of companies of Taiwan

## References

1. ↑ 1.0 1.1 Saperstein, Jeff; Rouach, Daniel (2002) (in en). Creating Regional Wealth in the Innovation Economy: Models, Perspectives, and Best Practices. FT Press. pp. 225. ISBN 978-0-13-065415-1. https://books.google.com/books?id=lQvUO4NTTFYC&dq=winbond+electronics&pg=PA225.
2. ↑ Jennex, Murray E. (2008) (in en). Knowledge Management: Concepts, Methodologies, Tools, and Applications. IGI Global. ISBN 978-1-59904-934-2. https://books.google.com/books?id=8IJE23SOK5wC&dq=winbond+electronics&pg=PA1588.
3. ↑ Misa, Thomas J.; Brey, Philip; Feenberg, Andrew (2003) (in en). Modernity and Technology. MIT Press. pp. 350. ISBN 978-0-262-63310-9. https://books.google.com/books?id=DV8IGo88aTQC&dq=winbond+electronics&pg=PA350.
4. ↑ Pan, Joshua Jih (1999) (in en). J.J. Pan and Partners: Selected and Current Works. Images Publishing. pp. 210–211. ISBN 978-1-86470-058-9. https://books.google.com/books?id=WfREioHgqQoC&dq=winbond+electronics&pg=PA210.
5. ↑ Corcoran, Cate (1992-07-27). "Winbond gives HP another notch in its PA-RISC belt". InfoWorld: p. 30. https://books.google.com/books?id=HVEEAAAAMBAJ&dq=winbond+electronics&pg=PA30.
6. ↑ LaPedus, Mark (October 30, 1995). "Winbond Plays It Out With Symphony". Electronic Buyers' News (CMP Publications): 3. ProQuest 228140765. https://www.proquest.com/docview/228140765/.
7. ↑ Tran, Mark (1999-09-21). "China offers aid after Taiwan quake" (in en-GB). The Guardian. ISSN 0261-3077. https://www.theguardian.com/world/1999/sep/21/marktran1.
8. ↑ Gupta, Jatinder N.D.; Sharma, Sushil Kumar (2004) (in en). Creating Knowledge Based Organizations. Idea Group Inc (IGI). p. 291. ISBN 978-1-59140-162-9. https://books.google.com/books?id=l3smT7mJRYsC&dq=winbond+electronics&pg=PA289.
9. ↑ Png, Ivan (2013) (in en). Managerial Economics (4th ed.). Routledge. ISBN 978-1-136-29757-1. https://books.google.com/books?id=Qk7_AFBkycMC&dq=winbond+electronics&pg=PT222.
10. ↑ "Winbond's innovative DRAM design and the legacy of Qimonda". EDN. 2010-08-12. https://www.edn.com/winbonds-innovative-dram-design-and-the-legacy-of-qimonda/.
11. ↑ Lynn, Alex (2019-12-02). "Winbond and Karamba Security partner for embedded cyber security" (in en). https://www.electronicspecifier.com/products/memory/winbond-and-karamba-security-partner-for-embedded-cyber-security.
12. ↑ Fowle, Harry (2023-02-17). "Winbond joins UCIe Consortium to support chiplet interface standardisation" (in en). https://www.electronicspecifier.com/news/winbond-joins-ucie-consortium-to-support-chiplet-interface-standardisation.

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SIP design|

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