IAg

IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.

## Contents

* 1 Description
* 1.1 Advantages of IAg
* 1.2 Disadvantages of IAg
* 2 Specifications
* 3 See also
* 4 References

## Description

It consists of a thin immersion silver plating over the copper traces.

### Advantages of IAg

* Excellent surface planarity (compared to e.g. HASL)
* Low High Frequency Signal loss due to skin effect

### Disadvantages of IAg

* Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
* Silver "whiskers" form across electrical potentials and short out components [1]

## Specifications

IPC Standard: IPC-4553

## See also

* Electroless Nickel Immersion Gold (ENIG)
* Hot Air Solder Leveling (HASL)
* Organic Solderability Preservative (OSP)
* Reflow soldering
* Wave soldering

## References

1. ↑ Slocum, Dan, Jr. (2003-09-25). "Surface Finishes Utilized in the PCB Industry". http://dcchapters.ipc.org/assets/pnw/presentations/20030925_Finishes.pdf.

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