Apple silicon

System-on-chip processors designed by Apple Inc.

The A16 Bionic chip Mac transition to
Apple silicon

* Apple silicon
* ARM architecture family
* Universal 2 binary
* Rosetta 2
* Developer Transition Kit

* v
* t
* e

Apple silicon refers to a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of Mac, iPhone, iPad, Apple TV, Apple Watch, AirPods, AirTag, HomePod, and Apple Vision Pro devices.

Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020.[1][2] The first Macs built with the Apple M1 chip were unveiled on November 10, 2020. As of June 2023, the entire Mac lineup uses Apple silicon chips.

Apple fully controls the integration of Apple silicon chips with the company's hardware and software products. Johny Srouji is in charge of Apple's silicon design.[3] Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as TSMC.

## A series[edit]

Evolution of Apple "A" series

| A4
March 12, 2010 – September 10, 2013| | | |
| | | |
| A5
March 2, 2011 – October 4, 2016| | | | |
| |
| | | | | | A5X
March 7 – October 23, 2012
| A6
September 12, 2012 – September 9, 2015| | | | | |
| | | | | | | A6X
October 23, 2012 – October 22, 2013
March 18 – October 16, 2014
| | | | | | | | |
| | | |
| A7
September 10, 2013 – March 21, 2017| | | |
| | | | | | | | |
| | | |
| A8
September 9, 2014 – October 18, 2022| | | | | |
| | | | | | | A8X
October 16, 2014 – March 21, 2017
| A9
September 9, 2015 – September 12, 2018 | | | | | |
| | | | | | | A9X
November 9, 2015 – June 5, 2017
| A10 Fusion
September 7, 2016 – May 10, 2022| | | | | |
| | | | | | | A10X Fusion
June 5, 2017 – April 20, 2021
| A11 Bionic
September 12, 2017 – April 15, 2020| | | | |
| | | | | | | | |
| A12 Bionic
September 12, 2018 – October 18, 2022| | | | | |
| | | | | | | A12X Bionic
October 30, 2018 – March 18, 2020
| A13 Bionic
September 10, 2019 – present| | | | |
| | | | | | | A12Z Bionic
March 18, 2020 – April 20, 2021
| A14 Bionic
September 15, 2020 – present| | |
| | | |
| A15 Bionic
September 14, 2021 – present| | | |
| | | |
| A16 Bionic
September 7, 2022 – present| | | |
| | | |
| A17 Pro
September 12, 2023 – present| | | |

The "A" series is a family of SoCs used in the iPhone, certain iPad models, and the Apple TV. "A" series chips were also used in the discontinued iPod Touch line and the original HomePod. They integrate one or more ARM-based processing cores (CPU), a graphics processing unit (GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.[4]

### Apple A4[edit]

Main article: Apple A4

The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.[5] It combines an ARM Cortex-A8 CPU - also used in Samsung's S5PC110A01 SoC[6][7] - and a PowerVR SGX 535 graphics processor (GPU),[8][9][10] all built on Samsung's 45-nanometer silicon chip fabrication process.[11][12] The design emphasizes power efficiency.[13] The A4 commercially debuted in 2010, in Apple's iPad tablet,[8] and was later used in the iPhone 4 smartphone,[14] the fourth-generation iPod Touch, and the 2nd-generation Apple TV.[15]

The Cortex-A8 core used in the A4, dubbed "Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple[16][17] It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM.[18] The A4 runs at different speeds in different products: 1 GHz in the first iPads,[19] 800 MHz in the iPhone 4 and fourth-generation iPod Touch, and an undisclosed speed in the 2nd-generation Apple TV.

The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less.[20] Other performance improvements include additional L2 cache.

The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod Touch,[21] and the 2nd-generation Apple TV[22] have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB.[23][24][25] The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.[26]

### Apple A5[edit]

Main article: Apple A5

The Apple A5 is an SoC manufactured by Samsung[27] that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011,[28] followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance",[29] according to Apple.

The A5 contains a dual-core ARM Cortex-A9 CPU[30] with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz,[31] though it can adjust its frequency to save battery life.[30][32] The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.[33]

An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4).[34] The chip in the Apple TV has one core locked.[35][36] Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.[37]

In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design.[38] Markings tell that it is named APL7498, and in software, the chip is called S5L8947.[39][40]

### Apple A5X[edit]

Main article: Apple A5X

The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5.[41] It was superseded in the fourth-generation iPad by the Apple A6X processor.

The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm²,[42] for example twice the size of Nvidia Tegra 3.[43] This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5.[44] The RAM in A5X is separate from the main CPU package.[45]

### Apple A6[edit]

Main article: Apple A6

The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5.[46] It is 22% smaller and draws less power than the 45 nm A5.[47]

The A6 is said to use a 1.3 GHz[48] custom[49] Apple-designed ARMv7 based dual-core CPU, called Swift,[50] rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3[51] graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4.[49] The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[52]

### Apple A6X[edit]

Main article: Apple A6X

Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.[53]

Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate.[54] It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem.[54][55] Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[55]

### Apple A7[edit]

Main article: Apple A7

The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6.[56] The Apple A7 chip is the first 64-bit chip to be used in a smartphone and later a tablet computer.[57]

The A7 features an Apple-designed 1.3[58]–1.4[59] GHz 64-bit[60] ARMv8-A[61][62] dual-core CPU,[58] called Cyclone,[61] and an integrated PowerVR G6430 GPU in a four cluster configuration.[63] The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6.[64] It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/NEON registers that are each 128-bits wide.[60] The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process[65] and the chip includes over 1 billion transistors on a die 102 mm2 in size.[58]

### Apple A8[edit]

Main article: Apple A8

The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014.[66] A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7.[67] On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.[68]

The A8 features an Apple-designed 1.4[69] GHz 64-bit[70] ARMv8-A[70] dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration.[69] The GPU features custom shader cores and compiler.[71] The A8 is manufactured on a 20 nm process[72] by TSMC,[73] which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm2 (consistent with a shrink only, not known to be a new microarchitecture).[74]

### Apple A8X[edit]

Main article: Apple A8X

The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014.[75] It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.[75][76]

Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate.[77] It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem.[77] It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.

### Apple A9[edit]

Main article: Apple A9

The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015.[78] Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8.[78] It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.

### Apple A9X[edit]

Main article: Apple A9X

The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro.[79] It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.[80]

### Apple A10 Fusion[edit]

Main article: Apple A10

The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016.[81] The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch.[82] It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.

### Apple A10X Fusion[edit]

Main article: Apple A10X

The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017.[83] It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X.[83] On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.[84]

### Apple A11 Bionic[edit]

Main article: Apple A11

The Apple A11 Bionic is a 64-bit ARM-based SoC[85] that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017.[85] It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10.[85][86] It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.[87]

### Apple A12 Bionic[edit]

Main article: Apple A12

The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic.[88] The A12 is manufactured by TSMC[89] using a 7 nm[90] FinFET process, the first to ship in a smartphone.[91][89] It is also used in the 6th generation Apple TV.

### Apple A12X Bionic[edit]

Main article: Apple A12X

The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018.[92] It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.

#### Apple A12Z Bionic[edit]

The Apple A12Z Bionic is an updated version of the A12X Bionic, first appearing in the fourth generation iPad Pro, which was announced on March 18, 2020.[93] It adds an additional GPU core, compared to the A12X, for improved graphics performance.[94] The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.[95]

### Apple A13 Bionic[edit]

Main article: Apple A13

The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020), the 9th generation iPad (announced September 14, 2021) and in the Studio Display (announced March 8, 2022)

The entire A13 SoC features a total of 18 cores – a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.[96]

### Apple A14 Bionic[edit]

Main article: Apple A14

The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor.[97] It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities. It was later used in the  tenth-generation iPad, released on October 26, 2022.

### Apple A15 Bionic[edit]

Main article: Apple A15

The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13 and 13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.[98][99] It is also used in the iPhone SE (3rd generation), iPhone 14, iPhone 14 Plus and iPad Mini 6.[100]

### Apple A16 Bionic[edit]

Main article: Apple A16

The Apple A16 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 14 Pro, unveiled on September 7, 2022. The A16 has 16 billion transistors and is built on TSMC's N4P fabrication process, being touted by Apple as the first 4 nm processor in a smartphone.[101][102] However, N4 is an enhanced version of N5 technology, a de facto fourth-generation 5 nm manufacturing process.[103][104][105] The chip has 2 high-performance processing cores, 4 high-efficiency cores and 5-core graphics for iPhone 14 Pro series. Memory is upgraded to LPDDR5 for 50% higher bandwidth and a 7% faster 16-core Neural Engine capable of 17 trillion operations per second.

### Apple A17 Pro[edit]

Main article: Apple A17

The Apple A17 Pro is a 64-bit ARM-based SoC that first appeared in the iPhone 15 Pro, unveiled on September 12, 2023. It is Apple's first 3nm SoC. The chip has 2 high-performance processing cores, 4 high-efficiency cores, a 6-core GPU for iPhone 15 Pro series, and a 16-core Neural Engine capable of 35 trillion operations per second. The GPU was described as their biggest redesign in the history of Apple GPUs, it added hardware accelerated Ray tracing and mesh shading support.[106]

### Comparison of A series processors[edit]

General  | Image  | Semiconductor technology | Computer architecture  | CPU  | GPU  | AI accelerator | Memory technology | First released date  | Devices  | Supported OS

|
|
|
|
|
|
|
|
|
|

Name  | Codename  | Part No.  | Node  | Manufacturer  | Transistors count  | Die size  | CPU ISA | Bit width  | Performance core  | Efficiency core  | Overall cores  | Cache  | Vendor  | Cores  | SIMD EU count  | FP32 ALU count  | Frequency  | FP32 FLOPS  | Cores  | OPS  | Memory bus width  | Total channel
Bit per channel  | Memory type  | Theoretical
bandwidth  | Available capacity  | Initial  | Terminal
Core name  | Cores  | Core speed  | Core name  | Cores  | Core speed  | L1  | L2  | L3  | SLC
[a] | APL0098  | S5L8900  |  | 90 nm
[107] | Samsung  |  | 72 mm2
[11] | ARMv6 | 32-bit  | ARM11 | 1  | 412 MHz  | —  | —  | —  | Single-core | L1i: 16 KB
L1d: 16 KB  | —  | —  | —  | PowerVR
MBX Lite | 1  | 1  | 8  | 60 MHz – 103 MHz  | 0.96 GFLOPS – 1.64 GFLOPS  | —  | —  | 16-bit  | 1 channel
16-bit/channel  | LPDDR-266
(133.25
MHz)  | 533 MB/s  | 128 MB  | June 29, 2007  | iPhone
iPod Touch (1st Gen) | iPhone OS 1.0
[b] | APL0278  | S5L8720  |  | 65 nm
[11] |  | 36 mm2
[11] | 533 MHz  | 103 MHz – 133 MHz  | 1.64 GFLOPs – 2.12 GFLOPS  | 32-bit  | 1 channel
32-bit/channel  | 1066 MB/s  | July 11, 2008  | iPhone 3G
iPod Touch (2nd Gen) | iPhone OS 2.1.1
[c] | APL0298  | S5L8920  |  |  | 71.8 mm2
[12] | ARMv7 | Cortex-A8 | 600 MHz  | L1i: 32 KB
L1d: 32 KB  | 256 KB  | PowerVR
SGX535
[108] | 2  | 16  | 200 MHz  | 6.4 GFLOPS  | LPDDR-400
(200 MHz)  | 1.6 GB/s  | 256 MB  | June 19, 2009  | iPhone 3GS | iPhone OS 3.0  | iOS 6.1.6
APL2298  | S5L8922  |  | 45 nm
[11][12]
[33] |  | 41.6 mm2
[11] | September 9, 2009  | iPod Touch (3rd Gen) | iPhone OS 3.1.1  | iOS 5.1.1
A4 | APL0398  | S5L8930  |  |  | 53.3 mm2
[11][12] | 800 MHz  | 512 KB  | 200 MHz – 250 MHz  | 6.4 GFLOPS – 8.0 GFLOPS  | 64-bit  | 2 channels
32-bit/channel  | 3.2 GB/s  | April 3, 2010  | iPad (1st Gen)
iPhone 4
iPod Touch (4th Gen)
Apple TV (2nd Gen) | iPhone OS 3.2
Apple TV Software 4.0  | iOS 6.1.6
1.0 GHz  | iOS 5.1.1[d]
Apple TV Software 6.2.1
800 MHz  | 512 MB  | iOS 7.1.2
A5 | APL0498  | S5L8940  |  |  | 122.2 mm2
[33] | Cortex-A9 | 2  | 800 MHz  | Dual-core | 1 MB  | PowerVR
SGX543
[109][51] | 2  | 4  | 32  | 200 MHz  | 12.8 GFLOPS  | LPDDR2-800
(400 MHz)  | 6.4 GB/s  | March 11, 2011  | iPad 2
iPhone 4S | iOS 4.3  | iOS 9.3.5[e]
iOS 9.3.6[f]
Apple TV Software 7.6.2
1.0 GHz
APL2498  | S5L8942  |  | 32 nm
Hκ MG
[34][40] |  | 69.6 mm2
[34] | 800 MHz  | March 7, 2012  | Apple TV (3nd Gen)
iPad 2
iPod Touch (5th Gen)
iPad Mini (1st Gen) | iOS 5.1
1.0 GHz
2 (One core locked)  | Dual-core
Single-core in actual  | Apple TV Software 5.0
APL7498  | S5L8947  |  |  | 37.8 mm2
[40] | 1  | Single-core | January 28, 2013  | Apple TV (3nd Gen Rev. A) | Apple TV Software 5.2
A5X | APL5498  | S5L8945  |  | 45 nm
[11][12]
[33] |  | 165 mm2
[42] | 2  | Dual-core | 4  | 8  | 64  | 25.6 GFLOPS  | 128-bit  | 4 channels
32-bit/channel  | 12.8 GB/s  | 1 GB  | March 16, 2012  | iPad (3rd Gen) | iOS 5.1
A6 | APL0598  | S5L8950  |  | 32 nm
Hκ MG
[52][110]
[55] |  | 96.71 mm2
[52][110] | ARMv7s[111] | Swift[49] | 1.3 GHz
[112] | 3  | 6  | 48  | 266 or 709 MHz  | 25.5 or 68.0 GFLOPS  | 64-bit  | 2 channels
32-bit/channel  | LPDDR2-1066
(533 MHz)  | 8.5 GB/s  | September 21, 2012  | iPhone 5
iPhone 5C | iOS 6.0  | iOS 10.3.3[g]
iOS 10.3.4[h]
A6X | APL5598  | S5L8955  |  |  | 123 mm2
[55] | 1.4 GHz
[54] | PowerVR
SGX554
[54][113] | 4  | 16  | 128  | 300 MHz  | 76.8 GFLOPS  | 128-bit  | 4 channels
32-bit/channel  | 17.0 GB/s  | November 2, 2012  | iPad (4th Gen)
A7 | APL0698  | S5L8960  |  | 28 nm
Hκ MG
[65][114] | 1 billion  | 102 mm2
[60][114] | ARMv8.0-A
[61][69] | 64-bit  | Cyclone  | 1.3 GHz  | L1i: 64 KB
L1d: 64 KB  | 4 MB (Inclusive)
[61][115][59] | PowerVR
G6430
[63][113] | 450 MHz  | 115.2 GFLOPS  | 64-bit  | 1 channel
64-bit/channel  | LPDDR3-1600
(800 MHz)  | 12.8 GB/s  | September 20, 2013  | iPhone 5S
iPad Mini 2
iPad Mini 3 | iOS 7.0  | iOS 12.5.7
APL5698  | S5L8965  |  | 1.4 GHz  | November 1, 2013  | iPad Air (1st Gen) | iOS 7.0.3
A8 | APL1011  | T7000  |  | 20 nm
Hκ MG
[70][69] | TSMC  | 2 billion  | 89 mm2
[116][77]
[117] | Typhoon  | 1.1 GHz  | PowerVR
GX6450
[71][118][119] | 533 MHz  | 136.4 GFLOPS  | September 19, 2014  | iPhone 6 & 6 Plus
iPod Touch (6th Gen)
iPad Mini 4
Apple TV HD
HomePod (1st Gen) | iOS 8.0
1.4 GHz
audioOS 11.0  | HomePod Software 15.6
(Current)
1.5 GHz  | 2 GB  | iOS 8.0
tvOS 9.0  | iPadOS 15.8
(Current)
tvOS 17.1
(Current)
A8X | APL1021  | T7001  |  | 3 billion  | 128 mm2
[77] | 3  | 1.5 GHz  | 3-core | 2 MB  | PowerVR
GX6850
[71][77][117] | 8  | 32  | 256  | 450 MHz  | 230.4 GFLOPS  | 128-bit  | 2 channels
64-bit/channel  | 25.6 GB/s  | October 22, 2014  | iPad Air 2 | iOS 8.1  | iPadOS 15.8
(Current)
A9 | APL0898  | S8000  |  | 14 nm
FinFET
[120] | Samsung  | ≥ 2 billion  | 96 mm2
[121] | Twister  | 2  | 1.85 GHz
[122][123] | Dual-core | 3 MB  | 4 MB (Victim)

[115][124]

| PowerVR
GT7600
[71][125] | 6  | 24  | 192  | 650 MHz  | 249.6 GFLOPS  | 64-bit  | 1 channel
64-bit/channel  | LPDDR4-3200
(1600 MHz)  | September 25, 2015  | iPhone 6S & 6S Plus
iPhone SE (1st Gen)
iPad (5th Gen) | iOS 9.0  | iOS 15.8
(Current)
iPadOS 16.7.2
(Current)
tvOS 17.1
(Current)
APL1022  | S8003  |  | 16 nm
FinFET
[121][126]
[127] | TSMC  | 104.5 mm2
[121]
A9X | APL1021  | S8001  |  | ≥ 3 billion  | 143.9 mm2
[126][84] | 2.16 GHz
[128][129] | —
[115][126] | PowerVR
GT7850
[71][126] | 12  | 48  | 384  | 499.2 GFLOPS  | 128-bit
(64-bit in actual)  | 2 channels
(one channel is unused)
64-bit/channel  | November 11, 2015  | iPad Pro 9.7-inch (2016) & iPad Pro 12.9-inch (2015) | iOS 9.1
2.26 GHz  | 128-bit  | 2 channels
64-bit/channel  | 51.2 GB/s  | 4 GB
A10 Fusion | APL1W24  | T8010  |  | 3.3 billion  | 125 mm2
[127] | ARMv8.1-A  | Hurricane  | 2  | 1.64 GHz  | Zephyr  | 2  | 1.09 GHz  | Quad-core
(Only 2 cores performed at a same time)  | P-core:
L1i: 64 KB
L1d: 64 KB

E-core:
L1i: 32 KB
L1d: 32KB  | P-core:
3 MB

E-core:
1 MB  | 4 MB  | PowerVR
GT7600
Plus[130][71]
[131][132] | 6  | 24  | 192  | 900 MHz  | 345.6 GFLOPS  | 64-bit  | 1 channel
64-bit/channel  | 25.6 GB/s  | 2 GB  | September 16, 2016  | iPhone 7 & 7 Plus
iPad (6th Gen)
iPad (7th Gen)
iPod Touch (7th gen) | iOS 10.0
2.34 GHz
3 GB
A10X Fusion | APL1071  | T8011  |  | 10 nm
FinFET
[84] | ≥ 4 billion  | 96.4 mm2
[84] | 3  | 2.38 GHz  | 3  | 1.30 GHz  | 6-core
(Only 3 cores performed at a same time)  | P-core:
8 MB

E-core:
1 MB  | —
[133][134] | 4 MB  | 12  | 48  | 384  | 1000 MHz  | 768.0 GFLOPS  | 128-bit  | 2 channels
64-bit/channel  | 51.2 GB/s  | 3 GB  | June 13, 2017  | iPad Pro 10.5-inch (2017) & iPad Pro 12.9-inch (2nd Gen)
Apple TV 4K (2017) | tvOS 11.0
4 GB  | iOS 10.3.2
A11
Bionic | APL1W72  | T8015  |  | 4.3 billion  | 87.66 mm2
[135] | ARMv8.2-A
[136] | Monsoon  | 2  | 2.39 GHz  | Mistral  | 4 (1 efficiency core disabled in Apple TV 4K 3rd Gen)  | 1.19 GHz  | 6-core | First
generation Apple-
designed  | 3  | 12  | 192  | 1066 MHz  | 409.3 GFLOPS  | 2  | 600 billion OPS  | 64-bit  | 4 channels
16-bit/channel  | LPDDR4X-4266
(2133 MHz)  | 34.1 GB/s  | 2 GB  | September 22, 2017  | iPhone 8 & 8 Plus
iPhone X | iOS 11.0  | iOS 16.7.2
(Current)
3 GB
A12
Bionic | APL1W81  | T8020  |  | 7 nm (N7)
FinFET
| 6.9 billion  | 83.27 mm2
[137] | ARMv8.3-A
[138] | Vortex  | 2.49 GHz  | Tempest  | 1.59 GHz  | P-core:
L1i: 128 KB
L1d: 128 KB

E-core:
L1i: 32 KB
L1d: 32KB  | P-core:
8 MB

E-core:
2 MB  | 8 MB  | Second
generation Apple-
designed (Apple G11P)  | 4  | 16  | 256  | 1125 MHz  | 576.0 GFLOPS  | 8  | 5 TOPS  | September 21, 2018  | iPhone XS & XS Max
iPhone XR
iPad Mini (5th Gen)
iPad Air (3rd Gen)
iPad (8th Gen)
Apple TV 4K (2nd Gen) | iOS 12.0
tvOS 14.5  | iOS 17.1.1
(Current)
iPadOS 17.1.1
(Current)
tvOS 17.1
(Current)
4 GB
A12X Bionic | APL1083  | T8027  |  | 10 billion  | 135 mm2
[139] | 4  | 8-core | Second generation Apple-
designed (Apple G11G)  | 7
| 28  | 448  | 1.008 TFLOPS  | 128-bit  | 2 channels
64-bit/channel  | 68.2 GB/s  | November 7, 2018  | iPad Pro 11-inch (1st Gen) & iPad Pro 12.9-inch (3rd Gen) | iOS 12.1
6 GB
A12Z Bionic |  | 8  | 32  | 512  | 1.152 TFLOPS  | March 25, 2020  | iPad Pro 11-inch (2nd Gen) & iPad Pro 12.9-inch (4th Gen) | iPadOS 13.4
16 GB  | June 22, 2020  | Developer Transition Kit (ARM, 2020) | macOS Big Sur 11.0 Beta 1  | macOS Big Sur 11.3 Beta 2
A13
Bionic | APL1W85  | T8030  |  | 7 nm (N7P)
FinFET | 8.5 billion  | 98.48 mm2
[140] | ARMv8.4-A
[141] | Lightning  | 2  | 2.66 GHz  | Thunder  | 1.72 GHz  | 6-core | P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 96 KB
L1d: 48 KB  | P-core:
8 MB

E-core:
4 MB  | 16 MB  | Third
generation Apple-
designed
[142] | 4  | 16
[143] | 256  | 1350 MHz  | 691.2 GFLOPS  | 5.5 TOPS  | 64-bit  | 4 channels
16-bit/channel  | 34.1 GB/s  | 3 GB  | September 20, 2019  | iPhone 11
iPhone 11 Pro & 11 Pro Max
iPhone SE (2nd Gen)
iPad (9th Gen)
Apple Studio Display | iOS 13.0
iPadOS 13.0  | iOS 17.1.1
(Current)
iPadOS 17.1.1
(Current)
tvOS 17.1
(Current)
4 GB
A14
Bionic | APL1W01  | T8101  |  | 5 nm (N5)
FinFET | 11.8 billion  | 88 mm2
[144] | ARMv8.5-A
[145] | Firestorm  | 3.00 GHz  | Icestorm  | 1.82 GHz  | P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB  | Fourth
generation Apple-
designed
[146][142][147]
[148] | 1462.5 MHz  | 748.8 GFLOPS  | 16  | 11 TOPS  | October 23, 2020  | iPad (10th Gen)
iPad Air (4th Gen)
iPhone 12 & 12 Mini
iPhone 12 Pro & 12 Pro Max | iOS 14.0
iPadOS 14.0
4 GB
A15
Bionic | APL1W07
[149] | T8110  |  | 5 nm (N5P)
FinFET | 15 billion  | 108.01 mm2
[149] | Avalanche  | 3.24 GHz  | Blizzard  | 2.02 GHz  | P-core:
12 MB

E-core:
4 MB  | 32 MB  | Fifth
generation Apple-
designed
[150][151][152] | 512
[143] | 1338 MHz
[143][153] | 1.370 TFLOPS  | 15.8 TOPS  | 4 GB  | September 24, 2021  | iPhone SE (3rd Gen)
iPhone 13 & 13 Mini
iPhone 13 Pro & 13 Pro Max
iPhone 14 & 14 Plus
iPad mini (6th Gen)
Apple TV 4K (3rd Gen)[154] | iOS 15.0
iPadOS 15.0
tvOS 16.1
2.93 GHz  | 5  | 20
[153][155] | 640
[153][155] | 1.712 TFLOPS
3.24 GHz  | 6 GB
A16
Bionic | APL1W10

[156]

| T8120  |  | 4 nm
(N4P)
FinFET

[103][104]
[105][102]
[157]

| 16 billion  | 112.75 mm2
[158] | ARMv8.6-A
[159] | Everest
[160][161] | 3.46 GHz  | Sawtooth
[160][161] | P-core:
16 MB

E-core:
4 MB

[162]

| 24 MB

[162]

| Sixth
generation Apple-
designed  | 1398 MHz
[155] | 1.789 TFLOPS
[155] | 17 TOPS  | LPDDR5-6400 (3200 MHz)  | 51.2 GB/s  | September 16, 2022  | iPhone 14 Pro & 14 Pro Max
iPhone 15 & 15 Plus | iOS 16.0
A17
Pro | APL1V02  | T8130  |  | 3 nm (N3B) FinFET | 19 billion  | 103.80 mm2
[158] | Everest  | 3.78 GHz
[163] | Sawtooth  | 2.11 GHz
[163] | Seventh
generation Apple-
designed  | 6  | 24  | 768  | 2.147 TFLOPS  | 35 TOPS  | 8 GB  | September 22, 2023  | IPhone 15 Pro & 15 Pro Max | iOS 17.0
Name  | Codename  | Part No.  | Image  | Node  | Manufacturer  | Transistors count  | Die size  | CPU ISA | Bit width  | Core name  | Cores  | Core speed  | Core name  | Cores  | Core speed  | Overall cores  | L1  | L2  | L3  | SLC  | Vendor  | Cores  | EU count  | ALU count  | Frequency  | FLOPS  | Cores  | OPS  | Memory bus width  | Total channel
Bit per channel  | Memory type  | Theoretical
bandwidth  | Available capacity  | First released date  | Devices  | Initial  | Terminal
Performance core  | Efficiency core  | Cache
General  | Semiconductor technology | Computer architecture  | CPU  | GPU  | AI accelerator | Memory technology | Supported OS

## H series[edit]

The Apple "H" series is a family of SoCs with low-power audio processing and wireless connectivity for use in headphones.

### Apple H1[edit]

The Apple H1 chip was used in AirPods 2nd and 3rd generation. It was also used in the Powerbeats Pro, the Beats Solo Pro, Beats Fit Pro, the AirPods Pro, the 2020 Powerbeats, AirPods Max.[164] Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands,[165] and offers 30 percent lower latency than the W1 chip used in earlier AirPods.[166]

### Apple H2[edit]

The Apple H2 chip was first used in the 2022 version of AirPods Pro. It has Bluetooth 5.3, and implements 48 kHz noise reduction in hardware. The 2022 version of the H2 supports Wi-Fi on the 2.4 GHz frequency, while the 2023 version adds support on the 5 GHz band.[167]

### Comparison of H series processors[edit]

Name  | Model no.  | Image  | Bluetooth  | First Released

|
|
|
|

H1 | 343S00289[168]
(AirPods 2nd Generation)
343S00290[169]
(AirPods 2nd Generation)
343S00404[170]
(AirPods Max)
H1 SiP[171]
(AirPods Pro)  |
| 5.0  | March 20, 2019
H2  | AirPods Pro (2nd generation)  |  | 5.3  | September 7, 2022

## M series[edit]

This section relies excessively on references to primary sources. Please improve this section by adding secondary or tertiary sources.
Find sources: "Apple silicon" – news · newspapers · books · scholar · JSTOR (November 2023) (Learn how and when to remove this template message)

|

This section reads like a press release or a news article and may be largely based on routine coverage. Please expand this article with properly sourced content to meet Wikipedia's  quality standards, event notability guideline, or encyclopedic content policy. (November 2023)

|

The Apple "M" series is a family of systems on a chip (SoC) used in Mac computers from November 2020 or later, iPad Pro tablets from April 2021 or later, iPad Air tablets from March 2022 or later, and Vision Pro. The "M" designation was previously used for Apple motion coprocessors.

Evolution of Apple "M" series

| M1
November 10, 2020 – present| | |
| | | | | | | M1 Pro
October 18, 2021 – January 17, 2023
| | | | | | | M1 Max
October 18, 2021 – June 5, 2023| | |

| | | | | | | | | | | |
| | | | | | | | | M1 Ultra
March 8, 2022 – June 5, 2023
| |
| M2
June 6, 2022 – present| | |
| | | | | | | M2 Pro
January 17, 2023 – present
| | | | | | | M2 Max
January 17, 2023 – present| | |

| | | | | | | | | | | |
| | | | | | | | | M2 Ultra
June 5, 2023 – present
| |
| M3
October 30, 2023 – present| | |
| | | | | | M3 Pro
October 30, 2023 – present
| | | | | | M3 Max
October 30, 2023 – present| |

### Apple M1[edit]

Main article: Apple M1

The M1, Apple's first system on a chip designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it is used in the MacBook Air (M1, 2020), Mac mini (M1, 2020), MacBook Pro (13-inch, M1, 2020), iMac (24-inch, M1, 2021), iPad Pro (5th generation) and iPad Air (5th generation). It comes with 4 performance cores and 4 efficiency cores, for a total of 8 CPU cores. It comes with up to 8 GPU cores, with the entry level MacBook Air having only 7 GPU cores. The M1 has 16 billion transistors.[172]

#### Apple M1 Pro[edit]

The M1 Pro is a more powerful version of the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple claimed the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).

#### Apple M1 Max[edit]

The M1 Max is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro, as well as the Mac Studio. Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.

#### Apple M1 Ultra[edit]

The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple's UltraFusion technology.[173] It has 114 billion transistors, 16 performance cores, 4 efficiency cores, 48 to 64 GPU cores and 32 Neural Engine cores; it can be configured with up to 128 GB unified RAM of 800 GB/s memory bandwidth. It was announced on March 8, 2022, as an optional upgrade for the Mac Studio. Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback.[174]

### Apple M2[edit]

Main article: Apple M2

Apple announced the M2 SoC on June 6, 2022, at WWDC, along with the new MacBook Air and the new 13-inch MacBook Pro and later the iPad Pro (6th generation). The M2 is made with TSMC's "Enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the previous generation M1. The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. The M2 also increases the memory bandwidth to 100 GB/s. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the previous M1.[175]

#### Apple M2 Pro[edit]

The M2 Pro is a more powerful version of the M2, with six to eight performance cores, four efficiency cores, 16 to 19 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and double the transistors. It was announced on January 17, 2023 in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro as well as the Mac Mini. Apple claims the CPU performance is 20 percent faster than the M1 Pro and the GPU is 30 percent faster than the M1 Pro.[176]

#### Apple M2 Max[edit]

The M2 Max is a larger version of the M2 Pro, with eight performance cores, four efficiency cores, 30 to 38 GPU cores, 16 Neural Engine cores, up to 96 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It was announced on January 17, 2023 in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro, as well as the Mac Studio.[177] Apple claims the CPU performance is 20 percent faster than M1 Max and the GPU is 30 percent faster than the M1 Max.[176]

#### Apple M2 Ultra[edit]

The M2 Ultra consists of two M2 Max dies connected together by a silicon interposer through Apple's UltraFusion technology. It has 134 billion transistors, 16 performance cores, 8 efficiency cores, 60 to 76 GPU cores and 32 Neural Engine cores; it can be configured with up to 192 GB unified RAM of 800 GB/s memory bandwidth. It was announced on June 5, 2023, as an optional upgrade for the Mac Studio and the sole processor for the Mac Pro. Apple claims the M2 Ultra can deliver up to 22 streams of 8K ProRes video playback.[178]

### Apple M3[edit]

Main article: Apple M3

Apple announced the M3 series of chips on October 30, 2023, along with the new MacBook Pro and iMac. The M3 is based on the 3 nm process and contains 25 billion transistors, a 25% increase from the previous generation M2. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. Apple claims CPU improvements up to 35% and GPU improvements up to 65% compared to the M1.[179]

#### Apple M3 Pro[edit]

The M3 Pro is a more powerful version of the M3, with six performance cores, six efficiency cores, 14 to 18 GPU cores, 16 Neural Engine cores, up to 36 GB unified RAM with 150 GB/s memory bandwidth, and 48% more transistors. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 30 percent faster than the M1 Pro and the GPU is 40 percent faster than the M1 Pro.[179]

#### Apple M3 Max[edit]

The M3 Max is a larger version of the M3 Pro, with ten or twelve performance cores, four efficiency cores, 30 to 40 GPU cores, 16 Neural Engine cores, up to 128 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 80 percent faster than the M1 Max and the GPU is 50 percent faster than the M1 Max.[179]

### Comparison of M series processors[edit]

General  | Semiconductor technology | CPU  | GPU  | AI accelerator | Memory technology | First release

|
|
|
|
|
|

Name  | Codename
and part no.  | Image  | Process  | Transistor count
and die size  | CPU ISA | Performance core  | Efficiency core  | Overall cores  | Cache  | Vendor  | Cores  | SIMD EU count  | FP32 ALU count  | Frequency  | FP32 FLOPS
(TFLOPS)  | Cores  | OPS  | Memory bus width  | Total channel
Bit per channel  | Memory type  | Theoretical
bandwidth  | Available capacity
Core name  | Cores  | Core speed  | Core name  | Cores  | Core speed  | L1  | L2  | SLC
M1 | APL1102
T8103  |  | TSMC
N5  | 16 billion
118.91 mm²
[180] | ARMv8.5-A  | Firestorm  | 4  | 3.204 GHz  | Icestorm  | 4  | 2.064 GHz  | 8-core | P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB  | P-core:
12 MB

E-core:
4 MB  | 8 MB  | Fourth generation Apple-designed  | 7  | 28  | 896  | 1278 MHz  | 2.290  | 16  | 11 TOPS  | 128-bit  | 2 channels
64-bit/channel  | LPDDR4X-4266
(2133 MHz)  | 68.25 GB/s  | 8 GB
16 GB[i] | November 17, 2020
8  | 32  | 1024  | 2.617
M1 Pro  | APL1103
T6000  |  | 33.7 billion
≈ 245 mm²
[181] | 6  | 3.228 GHz  | 2  | P-core:
24 MB

E-core:
4 MB  | 24 MB  | 14  | 56  | 1792  | 1296 MHz  | 4.644  | 256-bit  | 2 channels
128-bit/channel  | LPDDR5-6400
(3200 MHz)  | 204.8 GB/s  | 16 GB
32 GB[j] | October 26, 2021
8  | 10-core
16  | 64  | 2048  | 5.308
M1 Max  | APL1105
T6001
[182] |  | 57 billion
≈ 432 mm²
[181] | 48 MB  | 24  | 96  | 3072  | 7.962  | 512-bit  | 4 channels
128-bit/channel  | 409.6 GB/s  | 32 GB
64 GB[k]
32  | 128  | 4096  | 10.616
M1 Ultra  | APL1W06
T6002  |  | 114 billion
≈ 864 mm²  | 16  | 4  | 20-core | P-core:
48 MB

E-core:
8 MB  | 96 MB  | 48  | 192  | 6144  | 15.925  | 32  | 22 TOPS  | 1024-bit  | 8 channels
128-bit/channel  | 819.2 GB/s  | 64 GB
128 GB[l] | March 18, 2022
64  | 256  | 8192  | 21.233
M2 | APL1109
T8112  |  | TSMC
N5P  | 20 billion
155.25 mm²
[180] | Avalanche  | 4  | 3.504 GHz  | Blizzard  | 4  | 2.424 GHz  | 8-core | P-core:
16 MB

E-core:
4 MB  | 8 MB  | Fifth generation Apple-designed  | 8  | 32  | 1024  | 1398 MHz  | 2.863  | 16  | 15.8 TOPS  | 128-bit  | 2 channels
64-bit/channel  | 102.4 GB/s  | 8 GB
16 GB[m]
24 GB[n] | June 24, 2022
10  | 40  | 1280  | 3.578
M2 Pro  | APL1113
T6020  |  | 40 billion  | 6  | 10-core | P-core:
32 MB

E-core:
4 MB  | 24 MB  | 16  | 64  | 2048  | 5.726  | 256-bit  | 4 channels
64-bit/channel  | 204.8 GB/s  | 16 GB
32 GB[o] | January 24, 2023
8  | 12-core | 19  | 76  | 2432  | 6.799
M2 Max  | APL1111
T6021  |  | 67 billion  | 3.504 GHz (on 14-inch MacBook Pro)

3.696 GHz (on 16-inch MacBook Pro and Mac Studio)
[183]

| 48 MB  | 30  | 120  | 3840  | 10.736  | 512-bit  | 4 channels
128-bit/channel  | 409.6 GB/s  | 32 GB
64 GB[p]
96 GB[q]
38  | 152  | 4864  | 13.599
M2 Ultra  | APL1W12
T6022  |  | 134 billion  | 16  |
3.696 GHz
[183][184][185] | 8  | 24-core | P-core:
64 MB

E-core:
8 MB  | 96 MB  | 60  | 240  | 7680  | 21.473  | 32  | 31.6 TOPS  | 1024-bit  | 8 channels
128-bit/channel  | 819.2 GB/s  | 64 GB
128 GB[r]
192 GB[s] | June 13th, 2023
76  | 304  | 9728  | 27.199
M3 |  |  | TSMC
N3B  | 25 billion  | ARMv8.6-A  | Everest  | 4  | 4.056 GHz  | Sawtooth  | 4  | 2.748 GHz  | 8-core | P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB  | P-core:
16 MB

E-core:
4 MB  | 8 MB  | Seventh generation Apple-designed  | 8  | 128  | 1024  | 1380 MHz  | 2.826  | 16  | 18 TOPS  | 128-bit  | 2 channels
64-bit/channel  | 102.4 GB/s  | 8 GB
16 GB
24 GB  | November 7, 2023
10  | 160  | 1280  | 3.533
M3 Pro  |  |  | 37 billion  | 5  | 6  | 11-core | 24 MB  | 14  | 224  | 1792  | 4.946  | 192-bit  | 3 channels
64-bit/channel  | 153.6 GB/s  | 18 GB
36 GB
6  | 12-core | 18  | 288  | 2304  | 6.359
M3 Max  |  |  | 92 billion  | 10  | 4  | 14-core | P-core:
32 MB

E-core:
4 MB  | 48 MB  | 30  | 480  | 3840  | 10.598  | 384-bit  | 3 channels
128-bit/channel  | 307.2 GB/s  | 36 GB
96 GB
12  | 16-core | 40  | 640  | 5120  | 14.131  | 512-bit  | 4 channels
128-bit/channel  | 409.6 GB/s  | 48 GB
64 GB
128 GB
Name  | Codename
and part no.  | Image  | Process  | Transistor count
and die size  | CPU ISA | Core name  | Cores  | Core speed  | Core name  | Cores  | Core speed  | Overall cores  | L1  | L2  | SLC  | Vendor  | Cores  | EU count  | ALU count  | Frequency  | FP32 FLOPS
(TFLOPS)  | Cores  | OPS  | Memory bus width  | Total channel
Bit per channel  | Memory type  | Theoretical
bandwidth  | Available capacity  | First release
Performance core  | Efficiency core  | Cache
General  | Semiconductor technology | CPU  | GPU  | AI accelerator | Memory technology

### Comparison of device specs[edit]

Comparison of device specs  Name  | Connectivity  | Devices  | Supported OS

|
|
|

Ports  | External display  | Initial  | Terminal
Thunderbolt  | USB  | Max
M1 | Thunderbolt 3
(Up to 40 Gbit/s)[t] | USB4
(Up to 40 Gbit/s)[u]

USB 3.1 Gen 2
(Up to 10 Gbit/s)  | iPad Air/Pro:
1x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility[v]
MacBook Air/Pro:
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility & 1x 3.5 mm headphone jack
iMac (2 ports):
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet
iMac (4 ports):
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet
Mac mini:
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 1 or 10 Gb Ethernet  | All:
One 6016 x 3384 at 60 Hz display over Thunderbolt/USB-C

Mac mini:
One 6016 x 3384 at 60 Hz display over Thunderbolt
and one 3840 x 2160 at 60 Hz display over HDMI  |

* MacBook Air (M1, 2020) – base model has 7-core GPU[186]

* Mac Mini (M1, 2020)[187]

* MacBook Pro (13-inch, M1, 2020)[188]

* iMac (24-inch, M1, 2021) – base model has 7-core GPU[189]

* iPad Pro (11-inch, 3rd Gen)[190](2021)
* iPad Pro (12.9-inch, 5th Gen)[190] (2021)
* iPad Air (5th Gen) (2022)

| macOS Big Sur 11.0
iPadOS 14.5  | macOS Sonoma 14.1
(Current)
iPadOS 17.1.1
(Current)
M1 Pro  | Thunderbolt 4
(Up to 40
Gbit/s)  | MacBook Pro:
3x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x MagSafe 3  | Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt

One 6016 x 3384 at 60 Hz at 10-bit color depth display over Thunderbolt
and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI  |

* MacBook Pro (14-inch and 16-inch, 2021)

| macOS Monterey 12.0  | macOS Sonoma 14.1
(Current)
M1 Max  | MacBook Pro:
3x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x MagSafe 3

Mac Studio:
4x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet  | MacBook Pro:
Three 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt
and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI

Mac Studio:
Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt
and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI  |

* MacBook Pro (14-inch and 16-inch, 2021) \- 14-inch build-to-order only
* Mac Studio (2022)

M1 Ultra  | Mac Studio:
6x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet  | Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt
and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI  |

* Mac Studio (2022)

| macOS Monterey 12.3
M2 | Thunderbolt 3
(Up to 40 Gbit/s)[w]

Thunderbolt 4
(Up to 40 Gbit/s)[x] | iPad Pro:
1x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility

MacBook Air/Pro:
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4/ compatibility & 1x 3.5 mm headphone jack

Mac mini:
2x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 1 or 10 Gb Ethernet  | All:
One 6016 x 3384 at 60 Hz display over Thunderbolt

Mac mini:
One 6016 x 3384 at 60 Hz display over Thunderbolt
and one 5120 x 2880 at 60 Hz display over Thunderbolt

One 6016 x 3384 at 60 Hz display over Thunderbolt
and one 3840 x 2160 at 60 Hz display over HDMI  |

* MacBook Air (13-inch, M2, 2022) base model has 8-core GPU

* MacBook Air (15-inch, M2, 2023)

* MacBook Pro (13-inch, M2, 2022)

* iPad Pro (11-inch, 6th Gen) (2022)

* iPad Pro (12.9-inch, 6th Gen) (2022)

* Mac Mini (2023)

* Vision Pro (2024)[191]

| macOS Monterey 12.4
iPadOS 16.1  | macOS Sonoma 14.1
(Current)

iPadOS 17.1.1
(Current)

M2 Pro  | Thunderbolt 4
(Up to 40
Gbit/s)  | MacBook Pro:
3x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1 & 1x MagSafe 3 & 1x 3.5 mm headphone jack

Mac mini:
4x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x HDMI 2.1, 1x 3.5 mm headphone jack & 1x 1 or 10 Gb Ethernet  | All:
One 6016 x 3384 at 60 Hz display over Thunderbolt
and one 3840 x 2160 at 144 Hz display over HDMI

One 3840 x 2160 at 240 Hz display over HDMI

One 7680 x 4320 at 60 Hz display over HDMI

MacBook Pro:
Two 6016 x 3384 at 60 Hz displays over Thunderbolt
Mac mini:
Two 6016 x 3384 at 60 Hz displays over Thunderbolt and one 3840 x 2160 at 60 Hz display over HDMI  |

* MacBook Pro (14-inch and 16-inch, early 2023)
* Mac Mini (2023)

| macOS Ventura 13.2  | macOS Sonoma 14.1
(Current)
M2 Max  | MacBook Pro:
3x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x MagSafe 3 & 1x 3.5 mm headphone jack

Mac Studio:
4x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet  | All:
Two 6016 x 3384 at 60 Hz displays over Thunderbolt
and one 7680 x 4320 at 60 Hz display over HDMI

Two 6016 x 3384 at 60 Hz displays over Thunderbolt
and one 3840 x 2160 at 240 Hz display over HDMI

MacBook Pro:
Three 6016 x 3384 at 60 Hz displays over Thunderbolt
and one 3840 x 2160 at 144 Hz display over HDMI

Mac Studio:
Four 6016 x 3384 at 60 Hz displays over Thunderbolt
and one 3840 x 2160 at 60 Hz display over HDMI  |

* MacBook Pro (14-inch and 16-inch, early 2023)
* Mac Studio (2023)[192]

M2 Ultra  | Mac Studio:
6x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet
Mac Pro:
8x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 3x USB-A 3.0, 2x HDMI 2.1, 2x SATA 3.5, 1x 3.5 mm headphone jack, 2x 10 Gb Ethernet & 7x PCI Express expansion slots (1x 1/2 length Gen 3 x4, 6x full length Gen 4 (4x8 & 2x16))  | Eight 3840 x 2160 at 60 Hz displays

Six 6016 x 3384 at 60 Hz displays

Three 7680 x 4320 at 60 Hz displays over HDMI  |

* Mac Studio (2023)
* Mac Pro (2023)

| macOS Ventura 13.4
M3 | Thunderbolt 3
(Up to 40
Gbit/s)  | Macbook Pro:
2x TB 3 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x MagSafe 3 & 1x 3.5 mm headphone jack
iMac (2 ports):
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet
iMac (4 ports):
2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet  | All:
One 6016 x 3384 at 60 Hz display over Thunderbolt/USB-C

MacBook Pro:
Three 6016 x 3384 at 60 Hz displays over Thunderbolt
and one 3840 x 2160 at 144 Hz display over HDMI  |

* MacBook Pro (14-inch, late 2023)
* iMac (24-inch, 2023) – base model has 8-core GPU

| macOS Sonoma 14.1
M3 Pro  | Thunderbolt 4
(Up to 40
Gbit/s)  | MacBook Pro:
3x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x MagSafe 3 & 1x 3.5 mm headphone jack  | Three 6016 x 3384 at 60 Hz displays over Thunderbolt
and one 3840 x 2160 at 144 Hz display over HDMI  |

* MacBook Pro (14-inch and 16-inch, late 2023)

M3 Max
Name  | Thunderbolt  | USB  | Max  | External display  | Devices  | Initial  | Terminal
Ports
Connectivity  | Supported OS

## R series[edit]

### Apple R1[edit]

The Apple R1 was announced by Apple on June 5, 2023 at its Worldwide Developers Conference. It will be used in the Apple Vision Pro headset. The Apple R1 is dedicated to the real time processing of sensor inputs and delivering extremely low-latency images to the displays.

## S series[edit]

Evolution of Apple "S" series

| S1
September 9, 2014 – September 7, 2016| |
| | | |
| S2
September 7, 2016 – September 12, 2017| | |
| | | | | | | S1P
September 7, 2016 – September 12, 2018
| | | |
| S3
September 12, 2017 – September 7, 2022| |
| | | |
| S4
September 12, 2018 – September 10, 2019| |
| | | |
| S5
September 10, 2019 – present| |
| | | |
| S6
September 15, 2020 – September 14, 2021| |
| | | |
| S7
September 14, 2021 – September 7, 2022
January 18, 2023 – present| |
| | | |
| S8
September 7, 2022 – present| |
| | | |
| S9
September 12, 2023 – present| |

The Apple "S" series is a family of systems in a package (SiP) used in the Apple Watch and HomePod. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O form a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.

### Apple S1[edit]

Main article: Apple S1

The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.[193]

#### Apple S1P[edit]

Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.[194][195]

### Apple S2[edit]

Main article: Apple S2

Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor,[196] and is similar in performance to the Apple S1P.[197]

### Apple S3[edit]

Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver.[198] There is also an option for a cellular modem and an internal eSIM module.[198] It also includes the W2 chip.[198] The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.[198]

### Apple S4[edit]

Used in the Apple Watch Series 4. It has a custom 64-bit dual-core processor based on the A12 with up to 2× faster performance. It also contains the W3 wireless chip, which supports Bluetooth 5. The S4 introduced 64-bit ARMv8 cores to the Apple Watch. The chip contains two Tempest cores,[199][200] which are the energy-efficient cores found in the A12. Despite the small size, Tempest still uses a 3-wide decode out-of-order superscalar design, which make them much more powerful than previous in-order cores.

The S4 contains a Neural Engine that is able to run Core ML.[201] Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed.[202] It also contains a new custom GPU, which can use the Metal API.[203]

### Apple S5[edit]

Used in the Apple Watch Series 5, Watch SE, and HomePod mini.[204] It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.[205]

### Apple S6[edit]

Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5.[206][207] The dual cores in the S6 are based on the A13's energy-efficient "little" Thunder cores at 1.8 GHz.[208] Like the S4 and S5, it also contains the W3 wireless chip.[207] The S6 adds the new U1 ultra wideband chip, an always-on altimeter, and 5 GHz WiFi.[206][207]

### Apple S7[edit]

Used in the Apple Watch Series 7 and second-generation HomePod. The S7 has the same T8301 identifier and quoted performance as the S6.[209]

### Apple S8[edit]

Used in the Apple Watch SE (2nd generation), Watch Series 8, and Watch Ultra. The S8 adds a new three-axis gyroscope and high g-force accelerometer.[210] It has the same T8301 identifier and quoted performance as the S6 and S7.[211]

### Apple S9[edit]

Used in the Apple Watch Series 9 and Watch Ultra 2. The S9 has a new dual-core CPU with 60 percent more transistors than the S8, and a new four-core Neural Engine.[212]

### Comparison of S series processors[edit]

Name  | Model no.  | Image  | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory technology | Modem | First Released

|
|
|
|
|
|
|
|
|
|
|

S1 | APL
0778
[213] |  | 28 nm Hκ MG[214][215] | 32 mm2[214] | ARMv7k[215][216] | 520 MHz single-core Cortex-A7[215] | L1d: 32 KB[217]
L2: 256 KB[217] | PowerVR Series 5[215][218] | LPDDR3[219] |  | April 24, 2015
S1P | TBC  |  | TBC  | ARMv7k[220][221][196] | 520 MHz dual-core Cortex-A7 [220] | L1d: 32 KB[217] | PowerVR Series 6 'Rogue'[220] | LPDDR3  |  | September 12, 2016
S2 |  |
S3 |  | ARMv7k[222] | Dual-core | TBC  | LPDDR4  | Qualcomm MDM9635M
Snapdragon X7 LTE  | September 22, 2017
S4 |  | 7 nm (TSMC N7)  | TBC  | ARMv8-A ILP32[223][224] | 1.59 GHz Dual-core Tempest  | L1d: 32 KB[215]
L2: 2 MB[215] | Apple G11M[224] | TBC  | September 21, 2018
S5 |  | September 20, 2019
S6 |  | 7 nm (TSMC N7P)  | TBC  | 1.8 GHz Dual-core Thunder  | L1d: 48 KB[225]
L2: 4 MB[226] | TBC  | September 18, 2020
S7 |  | October 15, 2021
S8 |  | September 16, 2022
S9 |  | 5 nm  | Dual-core [227][228] | L1d: 64 KB[229]
L2: 4 MB[230] | September 22, 2023
Name  | Model no.  | Image  | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory technology | Modem | First Released

## T series[edit]

The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information (Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.[231] The functions of the T series processor were built into the M series CPUs, thus ending the need for the T series.

### Apple T1[edit]

The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.[232]

### Apple T2[edit]

Main article: Apple T2

The Apple T2 security chip is a SoC first released in the iMac Pro. It is a 64-bit ARMv8 chip (a variant of the A10 Fusion, or T8010).[233] It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive.[234][235][236] T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.[237][238]

### Comparison of T series processors[edit]

Name  | Model no.  | Image  | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory technology | First Released

|
|
|
|
|
|
|
|
|
|

Memory bandwidth
T1 | APL
1023
[239] |  | Same as S2  | TBC  | ARMv7  |  |  | TBD  |  | November
12, 2016
T2 | APL
1027
[240] |  | TSMC 16 nm FinFET.[241] | 104 mm2[241] | ARMv8-A
ARMv7-A  | 2× Hurricane
2× Zephyr
\+ Cortex-A7  | L1i: 64 KB
L1d: 64 KB
L2: 3 MB[241] | 3× cores[241] | LP-DDR4[241] | December
14, 2017
Name  | Model no.  | Image  | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory bandwidth | First Released
Memory technology

## U series[edit]

The Apple "U" series is a family of systems in a package (SiP) implementing ultra-wideband (UWB) radio.

### Apple U1[edit]

The Apple U1 is used in the iPhone 11 series up until the iPhone 15 series. (excluding the second and third generation iPhone SE), Apple Watch Series 6 (and Apple Watch Ultra) up until the Apple Watch Series 9 (and Apple Watch Ultra 2), HomePod (2nd generation), HomePod Mini, AirTag trackers and the charging case for AirPods Pro (2nd generation).[242]

### Apple U2[edit]

### Comparison of U series processors[edit]

Name  | Model no.  | Image  | CPU  | Semiconductor technology | First Released

|
|
|
|
|

U1  | TMK

A75
[243]

|  | Cortex-M4
ARMv7E-M[244] | 16 nm FinFET
(TSMC 16FF)  | September 20, 2019
U2  |  |  |  |  | September 22, 2023
Name  | Model no.  | Image  | CPU  | Semiconductor technology | First Released

## W series[edit]

The Apple "W" series is a family of RF SoCs used for Bluetooth and Wi-Fi connectivity.

### Apple W1[edit]

The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones.[245][246] It maintains a Bluetooth[247] Class 1 connection with a computer device and decodes the audio stream that is sent to it.[248]

### Apple W2[edit]

The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple claimed the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.[198]

### Apple W3[edit]

The Apple W3 is used in the Apple Watch Series 4,[249] Series 5,[250] Series 6,[207] SE (1st generation),[207] Series 7, Series 8, SE (2nd generation), and Ultra. It is integrated into the Apple S4, S5, S6, S7 and S8 SiPs. It supports Bluetooth 5.0/5.3.

### Comparison of W series processors[edit]

Name  | Model no.  | Image  | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | Memory technology | Bluetooth  | First Released

|
|
|
|
|
|
|
|
|
|

Memory bandwidth
W1 | 343S00130[251]
343S00131[251] |  | TBC  | 14.3
mm2
[251] | TBC  | 4.2  | December
13, 2016
W2 | 338S00348[252] |  | TBC  | September
22, 2017
W3 | 338S00464[253] |  | 5.0/5.3  | September
21, 2018
Name  | Model no.  | Image  | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | Memory bandwidth | Bluetooth  | First Released
Memory technology

## M series coprocessors[edit]

Main article: Apple motion coprocessors

The Apple M-series coprocessors are motion coprocessors used by Apple Inc. in their mobile devices. First released in 2013, their function is to collect sensor data from integrated accelerometers, gyroscopes and compasses and offload the collecting and processing of sensor data from the main central processing unit (CPU).

Only the M7 and M8 coprocessors were housed on separate chips; the M9, M10, and M11 coprocessors were embedded in their corresponding A-series chips. Beginning with the A12 Bionic chip in 2018, the motion coprocessors were fully integrated into the SoC; this allowed Apple to reuse the "M"-series codename for their desktop SoCs.

### Comparison of M series coprocessors[edit]

Name  | Model no.  | Image  | Semiconductor technology | CPU ISA | CPU | First Released  | Utilizing devices

|
|
|
|
|
|
|

Apple M7  | LPC18A1  |  | 90 nm  | ARMv7-M  | 150 MHz Cortex-M3 | September
10, 2013  |

* iPhone 5s
* iPad Air
* iPad Mini 2
* iPad Mini 3

Apple M8  | LPC18B1  |  | September
9, 2014  |

* iPhone 6
* iPhone 6 Plus
* iPad Mini 4
* iPod Touch (6th generation)

Name  | Model no.  | Image  | Semiconductor technology | CPU ISA | CPU | First Released  | Utilizing devices

## Miscellaneous devices[edit]

This segment is about Apple-designed processors that are not easily sorted into another section.

### Early series[edit]

See also: Early iPhone systems-on-chip

Apple first used SoCs in early versions of the iPhone and iPod Touch. They combine in one package a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary for mobile computing.

The APL0098 (also 8900B[254] or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process.[11] The iPhone 3G and the first-generation iPod Touch also use it.[255]

The APL0278[256] (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod Touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.[11][255]

The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.[107]

The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC[11] and was introduced on September 9, 2009, at the launch of the third-generation iPod Touch.

### Other[edit]

The Samsung S5L8747 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to-HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iPhone, iPod Touch, or iPad, then taking a serial signal from the iOS device translating that into a proper HDMI signal.[257][258]

Model no.  | Image  | First released  | CPU ISA | Specs  | Application  | Utilizing devices  | Operating system

|
|
|
|
|
|
|

339S0196  |  | September 2012  | Unknown

ARM

| 256 MB
RAM  | Lightning to
HDMI conversion  | Apple Digital
AV Adapter  | XNU
Model no.  | Image  | First released  | CPU ISA | Specs  | Application  | Utilizing devices  | Operating system

## See also[edit]

* ARM Cortex-A9
* List of iPhone models
* List of iPad models
* List of Mac models grouped by CPU type
* List of Samsung platforms (SoCs):
* Exynos (none have been used by Apple)
* historical (some were used in Apple products)
* PowerVR SGX GPUs were also used in the iPhone 3GS and the third-generation iPod Touch
* PWRficient, a processor designed by P.A. Semi, a company Apple acquired to form an in-house custom chip design department

### Similar platforms[edit]

* A31 by AllWinner
* Atom by Intel
* BCM2xxxx by Broadcom
* eMAG and Altra by Ampere Computing
* Exynos by Samsung
* i.MX by Freescale Semiconductor
* Jaguar and Puma by AMD
* Kirin by HiSilicon
* MTxxxx by MediaTek
* NovaThor by ST-Ericsson
* OMAP by Texas Instruments
* RK3xxx by Rockchip
* Snapdragon by Qualcomm
* Tegra by Nvidia

## Notes[edit]

1. ^ Could be referred to as "A1" though it is not labelled as such
2. ^ Could be referred to as "A2" though it is not labelled as such
3. ^ Sometimes referred to as "A3" though it is not labelled as such
4. ^ iPad (1st generation)
5. ^ iPod touch (5th generation), iPad 2 (Wi-Fi), iPad (3rd generation, Wi-Fi), iPad mini (1st generation, Wi-Fi)
6. ^ iPhone 4S, iPad 2 (Wi-Fi + Cellular), iPad (3rd generation, Wi-Fi + Cellular), iPad mini (1st generation, Wi-Fi + Cellular)
7. ^ iPhone 5C and iPad (4th generation, Wi-Fi)
8. ^ iPhone 5 and iPad (4th generation, Wi-Fi + Cellular)
9. ^ iPad Pro 12.9-inch (5th generation) with 1 TB and 2 TB storage, iPad Pro 11-inch (3rd generation) with 1 TB and 2 TB storage, online configured MacBook Air (M1) and online configured MacBook Pro 13-inch (M1)
10. ^ Online configured MacBook Pro 14-inch (2021) and online configured MacBook Pro 16-inch (2021)
11. ^ Online configured MacBook Pro 14-inch (2021), online configured MacBook Pro 16-inch (2021) and online configured Mac Studio (2022)
12. ^ Online configured Mac Studio (2022)
13. ^ iPad Pro 12.9-inch (6th generation) with 1 TB and 2 TB storage, iPad Pro 11-inch (4th generation) with 1 TB and 2 TB storage, online configured MacBook Air (M2) and online configured MacBook Pro 13-inch (M2)
14. ^ Online configured MacBook Air (M2) and online configured MacBook Pro 13-inch (M2)
15. ^ Online configured Mac mini (M2 Pro, 2023), online configured MacBook Pro 14-inch (2023) and online configured MacBook Pro 16-inch (2023)
16. ^ Online configured MacBook Pro 14-inch (2023), online configured MacBook Pro 16-inch (2023) and online configured Mac Studio (2023)
17. ^ Online configured MacBook Pro 14-inch (2023) with 38-core GPU, online configured MacBook Pro 16-inch (2023) with 38-core GPU and online configured Mac Studio (2023) with 38-core GPU
18. ^ Online configured Mac Studio (2023) and Online configured Mac Pro (2023)
19. ^ Online configured Mac Studio (2023) and Online configured Mac Pro (2023)
20. ^ Except iPad Air (5th generation)
21. ^ Except iPad Air (5th generation)
22. ^ Except iPad Air (5th generation) which only contains 1x USB-C 3.1 Gen 2 with DP 1.4 compatibility
23. ^ iPad Pro, MacBook Air and MacBook Pro 13-inch
24. ^ Mac mini (M2, 2023) only

## References[edit]

1. ^ "Apple announces Mac transition to Apple silicon" (Press release). Apple. June 22, 2020. Archived from the original on June 22, 2020. Retrieved June 23, 2020.
2. ^ Warren, Tom (June 22, 2020). "Apple is switching Macs to its own processors starting later this year". The Verge. Archived from the original on June 22, 2020. Retrieved June 22, 2020.
3. ^ "The Most Important Apple Executive You've Never Heard Of". Bloomberg News. Archived from the original on March 31, 2019. Retrieved June 18, 2016.
4. ^ Lovejoy, Ben (July 18, 2016). "Apple reportedly dropping Samsung for not only A10 in iPhone 7 but also A11 in iPhone 8". 9to5Mac. Archived from the original on July 3, 2020. Retrieved July 1, 2020.
5. ^ Clark, Don (April 5, 2010). "Apple iPad Taps Familiar Component Suppliers – WSJ.com". Online.wsj.com. Archived from the original on September 19, 2018. Retrieved April 15, 2010.
6. ^ Boldt, Paul; Scansen, Don; Whibley, Tim (June 16, 2010). "Apple's A4 dissected, discussed...and tantalizing". EE Times. Archived from the original on October 22, 2021. Retrieved October 22, 2021.
7. ^ "Microsoft PowerPoint – Apple A4 vs SEC S5PC110A01" (PDF). Archived from the original (PDF) on July 4, 2010. Retrieved July 7, 2010.
8. ^ a b "Apple Launches iPad" (Press release). Apple. January 27, 2010. Archived from the original on May 25, 2017. Retrieved January 28, 2010.
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## Further reading[edit]

* Gurman, Mark (January 29, 2018). "How Apple Built a Chip Powerhouse to Threaten Qualcomm and Intel". Bloomberg Businessweek.

* v
* t
* e

Apple silicon

A series|

| Current|

* A13 Bionic
* A14 Bionic
* A15 Bionic
* A16 Bionic
* A17 Pro

|

Discontinued|

* A4
* A5
* A5X
* A6
* A6X
* A7
* A8
* A8X
* A9
* A9X
* A10 Fusion
* A10X Fusion
* A11 Bionic
* A12 Bionic
* A12X / A12Z Bionic

H series|

* H1
* H2

M series|

| Current|

* M1
* M2 / M2 Pro / M2 Max / M2 Ultra
* M3 / M3 Pro / M3 Max

|

Discontinued|

* M1 Pro / M1 Max / M1 Ultra

R series|

* R1

S series|

| Current|

* S5
* S7
* S8

|

Discontinued|

* S1 / S1P
* S2
* S3
* S4
* S6

T series|

* T1
* T2

U Series|

* U1

W series|

* W1
* W2
* W3

* v
* t
* e

Apple hardware

Apple II
family|

* Apple I
* Apple II series
* II
* II Plus
* IIe
* IIe Card
* Processor Direct Slot
* IIc
* IIc Plus
* IIGS
* Apple III
* Apple Lisa
* Macintosh XL

Mac|

| Desktops|

* Compact
* 128K
* 512K
* 512Ke
* Plus
* SE
* SE/30
* Classic
* Classic II
* Color Classic
* II family
* II
* IIx
* IIcx
* IIci
* IIfx
* IIsi
* IIvi
* IIvx
* LC family
* LC
* LC II
* LC III
* LC 475
* LC 500 series
* LC 630
* 5200 LC
* Macintosh TV
* Quadra
* 610
* 650
* 660AV
* 605
* 630
* 700
* 900
* 950
* 800
* 840AV
* Performa
* Centris
* Power Macintosh
* 4400 and 7220
* 5000 series
* 5200 LC and 5300 LC
* 5260
* 5400
* 5500
* 6000 series
* 6100
* 6200 and 6300
* 6400
* 6500
* 7000 series
* 7100
* 7200 and 8200
* 7300
* 7500
* 7600
* 8000 series
* 8100
* 8500
* 8600
* 9000 series
* 9500
* 9600
* G3
* G4
* G4 Cube
* G5
* 20th Anniversary
* iMac
* G3
* G4
* G5
* Intel
* Pro
* Apple silicon
* eMac
* Mac Pro
* Mac Mini
* Mac Studio

|

Laptops|

* Macintosh Portable
* PowerBook
* 100 series
* 100
* 140
* 170
* 160
* 180
* 150
* 190
* Duo
* 210
* 230
* 500 series
* 5300
* 1400
* 3400c
* 2400c
* G3
* G4
* iBook
* MacBook
* 2006–2012
* 2015–2019
* MacBook Air
* Intel
* Apple silicon
* MacBook Pro
* Intel
* Apple silicon

Servers|

* Workgroup Server
* 9150
* Network Server
* Xserve

Devices|

| iPhone|

* 1st
* 3G
* 3GS
* 4
* 4S
* 5
* 5C
* 5S
* 6 / 6 Plus
* 6S / 6S Plus
* 7 / 7 Plus
* 8 / 8 Plus
* X
* XR
* XS / XS Max
* 11
* 11 Pro / 11 Pro Max
* 12 / 12 Mini
* 12 Pro / 12 Pro Max
* 13 / 13 Mini
* 13 Pro / 13 Pro Max
* 14 / 14 Plus
* 14 Pro / 14 Pro Max
* 15 / 15 Plus
* 15 Pro / 15 Pro Max
* iPhone SE
* 1st
* 2nd
* 3rd

|

iPad|

* 1st
* 2
* 3rd
* 4th
* 5th
* 6th
* 7th
* 8th
* 9th
* 10th
* iPad Air
* 1st
* 2
* 3rd
* 4th
* 5th
* iPad Mini
* 1st
* 2
* 3
* 4
* 5th
* 6th
* iPad Pro
* 9.7 / 12.9 (1st)
* 10.5 / 12.9 (2nd)
* 11 (1st) / 12.9 (3rd)
* 11 (2nd) / 12.9 (4th)
* 11 (3rd) / 12.9 (5th)
* 11 (4th) / 12.9 (6th)

iPod|

* Classic
* Mini
* Nano
* Shuffle
* Touch
* 1st
* 2nd
* 3rd
* 4th
* 5th
* 6th
* 7th

Unreleased|

* AirPower
* Interactive Television Box
* Mac NC
* Vision Pro
* W.A.L.T.

* Apple TV
* Apple Watch
* Beddit
* Newton
* MessagePad
* eMate 300
* Paladin
* Pippin
* Bandai
* PowerCD
* QuickTake

Accessories|

| Audio|

* AirPods
* Pro
* Max
* Beats
* Pill
* Headphones
* Speakers
* iPod Hi-Fi
* SoundSticks
* HomePod
* Mini

|

Displays|

* Monitor III
* Monitor II
* AppleColor Composite IIe
* AppleColor High-Resolution RGB
* Color
* AudioVision 14
* Multiple Scan 14
* ColorSync 750
* Studio Display
* Studio (1998–2004)
* Studio (2022)
* Cinema
* Thunderbolt
* Pro Display XDR

Drives|

* Disk II
* Macintosh
* ProFile
* Hard Disk 20
* Hard Disk 20SC
* AppleCD
* PowerCD
* Tape Drive 40SC
* SuperDrive
* Xserve RAID

Input|

* Desktop Bus
* iPad accessories
* Pencil
* iSight
* Keyboards
* Extended
* Adjustable
* Wireless
* Magic

* Mice and trackpads
* USB
* Mighty
* Magic
* Magic Trackpad
* Remote
* Siri Remote
* Scanner
* OneScanner

iPod|

* Click wheel
* Nike+iPod

Networking|

* AirPort
* Express
* Extreme
* Time Capsule
* Apple II serial cards
* USB Modem
* LocalTalk
* Communication Slot
* GeoPort

Printers|

* Silentype
* Dot Matrix Printer
* Letter Quality Printer
* ImageWriter
* LaserWriter
* 410 Color Plotter
* Color LaserWriter
* StyleWriter

Security|

* AirTag

Silicon|

* A series
* A4
* A5
* A5X
* A6
* A6X
* A7
* A8
* A8X
* A9
* A9X
* A10
* A10X
* A11
* A12
* A12X/A12Z
* A13
* A14
* A15
* A16
* A17
* H series
* H1
* H2
* M series
* M1
* M2
* M3
* R series
* R1
* S series
* S1
* S1P
* S2
* S3
* S4
* S5
* S6
* S7
* S8
* T series
* T1
* T2
* U series
* U1
* W series
* W1
* W2
* W3

* Hardware lists
* Macs
* iPhones
* iPads
* Timeline of Apple Inc. products

* v
* t
* e

Apple Inc.

* History
* Outline
* Timeline of products
* Environment
* Marketing
* Supply chain

Products|

| Hardware|

* iPhone
* Hardware
* History
* TV
* Watch
* AirPods
* Pro
* Max
* AirTag
* Beats
* Pill
* Powerbeats Pro
* HomePod
* Mini
* Silicon
* Vision Pro

Mac|

* iMac
* Pro
* MacBook
* Air
* Pro
* Mini
* Studio
* Pro

iPod|

* Classic
* Mini
* Nano
* Shuffle
* Touch

iPad|

* Mini
* Air
* Pro
* Accessories

Other|

* Apple SIM

Software|

| Operating
systems|

* iOS / iPadOS
* iPhones
* iPads
* iOS history
* iPadOS history
* Apps
* macOS
* History
* Server
* tvOS
* watchOS
* bridgeOS
* Darwin
* Classic Mac OS
* visionOS

|

* CarPlay
* Classroom
* HomeKit
* Core Foundation
* Developer Tools
* FileMaker
* Final Cut Pro
* X
* Compressor
* Motion
* Logic Pro
* MainStage
* iLife
* GarageBand
* iMovie
* iPhoto
* iTunes
* iWork
* Keynote
* Numbers
* Pages
* Mail
* QuickTime
* Safari
* Shazam
* Siri
* Swift
* Xcode

Services|

| Financial|

* Card
* Pay
* Wallet

|

Media|

* Arcade
* Books
* Music
* 1
* Beats Music
* Up Next
* Festival
* iTunes Radio
* App
* News
* Newsstand
* Podcasts
* TV
* +
* originals
* MLS Season Pass

Communication|

* FaceTime
* Walkie-Talkie
* iMessage
* iChat
* App
* Game Center

Retail and
digital sales|

* App Store
* macOS
* iTunes Store
* Connect
* Store
* Fifth Avenue

Support|

* AppleCare+
* AASP
* Certifications
* Genius Bar
* ProCare
* One to One

Other|

* ID
* Sign in with Apple
* One
* Developer
* iAd
* TestFlight
* WWDC
* iCloud
* MobileMe
* Find My
* Fitness
* Photos
* Maps
* Look Around

Companies|

| Subsidiaries|

* Anobit
* Apple IMC
* Apple Studios
* Beats
* Beddit
* Braeburn Capital
* Claris

|

Acquisitions|

* Completed
* Anobit
* AuthenTec
* Beats
* Beddit
* Cue
* EditGrid
* Emagic
* FingerWorks
* Intrinsity
* InVisage Technologies
* The Keyboard Company
* Lala
* Metaio
* NeXT
* Nothing Real
* P.A. Semi
* Power Computing
* PrimeSense
* Shazam Entertainment Limited
* Siri
* Texture
* Topsy
* Potential
* Disney

Partnerships|

* AIM alliance
* Kaleida Labs
* Taligent
* Akamai
* Arm
* DiDi
* Digital Ocean
* iFund
* Imagination
* Rockstar Consortium

Related|

* Advertising
* "1984"
* "Think different"
* "Get a Mac"
* iPod
* Product Red
* Ecosystem
* Events
* Headquarters
* Campus
* Park
* University
* Design
* IDg
* Typography
* Book
* History
* Codenames
* Community
* AppleMasters
* Litigation
* FBI encryption dispute
* iOS app approvals
* Worker organizations
* Depictions of Steve Jobs
* Linux
* Asahi Linux
* iPodLinux
* Titan

People|

| Executives|

| Current|

* Tim Cook (CEO)
* Jeff Williams (COO)
* Luca Maestri (CFO)
* Katherine Adams (General Counsel)
* Eddy Cue
* Craig Federighi
* Isabel Ge Mahe
* John Giannandrea
* Lisa Jackson
* Greg Joswiak
* Sabih Khan
* Deirdre O'Brien
* Dan Riccio
* Phil Schiller
* Johny Srouji
* John Ternus

|

Former|

* Michael Scott (CEO)
* Mike Markkula (CEO)
* John Sculley (CEO)
* Michael Spindler (CEO)
* Gil Amelio (CEO)
* Steve Jobs (CEO)
* Jony Ive (CDO)
* Angela Ahrendts
* Fred D. Anderson
* John Browett
* Guerrino De Luca
* Paul Deneve
* Al Eisenstat
* Tony Fadell
* Scott Forstall
* Ellen Hancock
* Nancy R. Heinen
* Ron Johnson
* David Nagel
* Peter Oppenheimer
* Mark Papermaster
* Jon Rubinstein
* Bertrand Serlet
* Bruce Sewell
* Sina Tamaddon
* Avie Tevanian
* Steve Wozniak

Board of
directors|

| Current|

* Arthur D. Levinson (Chairman)
* Tim Cook (CEO)
* James A. Bell
* Alex Gorsky
* Al Gore
* Andrea Jung
* Ronald D. Sugar
* Susan L. Wagner

|

Former|

* Mike Markkula (Chairman)
* John Sculley (Chairman)
* Steve Jobs (Chairman)
* Gil Amelio
* Fred D. Anderson
* Bill Campbell
* Mickey Drexler
* Al Eisenstat
* Larry Ellison
* Robert A. Iger
* Delano Lewis
* Arthur Rock
* Eric Schmidt
* Michael Scott
* Michael Spindler
* Edgar S. Woolard Jr.
* Jerry York

Founders|

* Steve Jobs
* Steve Wozniak
* Ronald Wayne

* Italics indicate discontinued products, services, or defunct companies.
* Category

* v
* t
* e

Electronics industry in the United States

Companies|

| Home appliances|

* Apple
* Bose
* Cisco
* Corsair
* Dell
* Dolby Laboratories
* Element Electronics
* Emerson Radio
* Harman
* Honeywell
* HP
* InFocus
* Jensen Electronics
* Kenmore
* Kingston
* Kimball
* Koss
* Lexmark
* Logitech
* Magnavox
* Marantz
* Memorex
* Microsoft
* Monster
* Plantronics
* Planar Systems
* Pyle USA
* Razer
* Seagate
* Seiki Digital
* Skullcandy
* Turtle Beach
* ViewSonic
* Vizio
* Western Digital
* HGST
* SanDisk
* Westinghouse Electric Company
* Westinghouse Electronics
* Xerox

|

Electronic components|

* 3M
* Achronix
* Analog Devices
* Maxim Integrated
* Applied Materials
* Altera
* AVX
* Cirque
* Diodes Inc.
* Flex
* Jabil
* KEMET
* Maxwell Technologies
* Sanmina
* Vishay

Semiconductor devices|

* AMD
* Ampere Computing
* Apple
* Broadcom
* Cypress Semiconductor
* GlobalFoundries
* IBM
* Intel
* Interlink
* KLA-Tencor
* Lam Research
* Lattice
* Marvell Technology
* Microchip (Atmel)
* Micron
* NetApp
* Nimbus Data
* Nvidia
* Mellanox
* NXP
* Onsemi
* Qualcomm
* Silicon Image
* Synaptics
* Tabula
* Texas Instruments
* Xilinx
* Zilog

Mobile devices|

* Apple
* BLU
* Google
* Lenovo (Motorola Mobility)

Other|

* Cadence Design Systems
* Cray
* GE
* RCA
* Oracle Corporation
* Synopsys

Defunct|

* Actel
* Atari Corporation
* Commodore
* Compaq
* Fairchild
* Freescale
* LSI
* Microsemi
* National Semiconductor
* Palm
* Philco
* RCA
* Signetics
* Silicon Graphics
* Solectron
* Sun Microsystems
* Zenith Electronics

* v
* t
* e

ARM-based chips

* v
* t
* e

Application ARM-based chips

* Arm
* ARM architecture family
* List of ARM processors
* List of products using ARM processors
* ARM Cortex-A
* ARM Cortex-R
* ARM Cortex-M
* Comparison of ARM processors

Application
processors
(32-bit)|

| ARMv7-A|

| Cortex-A5|

* Actions ATM702x
* Amlogic M805/S805, T82x
* Atmel SAMA5D3
* InfoTM iMAPx820, iMAPx15
* Qualcomm Snapdragon S4 Play, 200
* RDA RDA8810PL
* Telechips TCC892x

|

Cortex-A7|

* Allwinner A2x, A3x, A83T, H3, H8
* NXP i.MX7, QorIQ LS10xx, NXP i.MX6UL
* Broadcom VideoCore BCM2836, BCM23550
* Leadcore LC1813, LC1860/C, LC1913, LC1960
* Marvell Armada PXA1920, 1500 mini plus
* MediaTek MT65xx
* Qualcomm Snapdragon 200, 400

Cortex-A8|

* Allwinner A1x
* Apple A4
* Freescale i.MX5
* Rockchip RK291x
* Samsung Exynos 3110(S5PC110), S5PV210
* Texas Instruments OMAP 3
* Texas Instruments Sitara AM3xxx
* Texas Instruments DM38x
* ZiiLABS ZMS-08

Cortex-A9|

* Actions ATM702x, ATM703x
* Altera Cyclone V, Arria V/10
* Amlogic AML8726, MX, M6x, M801, M802/S802, S812, T86x
* Apple A5, A5X
* Broadcom VideoCore BCM21xxx, BCM28xxx
* Freescale i.MX6
* HiSilicon K3V2, 910's
* InfoTM iMAPx912
* Leadcore LC1810, LC1811
* Marvell Armada 1500 mini
* MediaTek MT65xx
* Nvidia Tegra, 2, 3, 4i
* Nufront NuSmart 2816M, NS115, NS115M
* Renesas EMMA EV2, R-Car H1, RZ/A
* Rockchip RK292x, RK30xx, RK31xx
* Samsung Exynos 4 421x, 441x
* ST-Ericsson NovaThor
* Telechips TCC8803
* Texas Instruments OMAP 4
* Texas Instruments Sitara AM4xxx
* VIA WonderMedia WM88x0, 89x0
* Xilinx Zynq-7000
* ZiiLABS ZMS-20, ZMS-40

Cortex-A15|

* Allwinner A80
* HiSilicon K3V3
* MediaTek MT8135/V
* Nvidia Tegra 4, K1
* Renesas R-Car H2
* Samsung Exynos 5 52xx, 54xx
* Texas Instruments OMAP 5, DRA7xx, AM57xx
* Texas Instruments Sitara AM5xxx

Cortex-A17|

* MediaTek MT6595, MT5595
* MStar 6A928
* Rockchip RK3288

Others|

* Cortex-A12

ARMv7-A
compatible|

* Apple A6, A6X, S1, S1P, S2, S3
* Broadcom Brahma-B15
* Marvell P4J
* Qualcomm Snapdragon S1, S2, S3, S4 Plus, S4 Pro, 600, 800 (Scorpion, Krait)

ARMv8-A|

| Others|

* Cortex-A32

|

Application
processors
(64-bit)|

| ARMv8-A|

| Cortex-A35|

* NXP i.MX8X
* MediaTek MT6799, MT8516
* Rockchip RK3308

|

Cortex-A53|

* Actions GT7, S900, V700
* Allwinner A64, H5, H64, R18
* Altera Stratix 10
* Amlogic S9 Family, T96x
* Broadcom BCM2837
* EZchip TILE-Mx100
* HiSilicon Kirin 620, 650, 655, 658, 659, 930, 935
* Marvell Armada PXA1928, Mobile PXA1908/PXA1936
* MediaTek MT673x, MT675x, MT6761V, MT6762/V, MT6763T, MT6765/G/H, MT6795, MT8161, MT8163, MT8165, MT8732, MT8735, MT8752
* NXP ARM S32, QorIQ LS1088, LS1043, i.MX8M
* Qualcomm Snapdragon 215, 410, 412, 415, 425, 427, 430, 435, 429, 439, 450, 610, 615, 616, 617, 625, 626, 630
* Renesas RZ/V2M
* Rockchip RK3328, RK3368
* Samsung Exynos 7570, 7578, 7580, 7870, 7880
* Texas Instruments Sitara AM6xxx
* UNISOC SC9820E, SC9832E, SC9860/GV
* Xilinx ZynqMP

Cortex-A57|

* AMD Opteron A1100-series
* NXP QorIQ LS20xx
* Nvidia Tegra X1 and Tegra X2
* Qualcomm Snapdragon 808 and 810
* Samsung Exynos 7 5433, 7420
* HiSilicon Kirin Hi1610 and Hi1612

Cortex-A72|

* AWS Graviton
* Broadcom BCM2711
* HiSilicon Kirin 950, 955, Kunpeng 916
* MediaTek MT6797/D/T/X, MT8173, MT8176, MT8693
* MStar 6A938
* Qualcomm Snapdragon 650, 652, 653
* Rockchip RK3399
* NXP QorIQ LS2088, QorIQ LS1046A, QorIQ LX2160A, QorIQ LS1028A, i.MX8

Cortex-A73|

* Qualcomm Snapdragon 460, 636, 660, 632, 662, 665, 680, 685, 835
* Samsung Exynos 7872, 7884, 7885, 7904, 9609, 9610, 9611
* HiSilicon Kirin 710, 960, 970
* MediaTek MT6771/V, MT6799, MT8183
* Amlogic S922X

Others|

* Cortex-A34

ARMv8-A
compatible|

* Ampere eMAG
* Apple A7, A8, A8X, A9, A9X, A10, A10X
* Applied Micro X-Gene
* Cavium ThunderX
* Nvidia Tegra K1 (Denver), Tegra X2 (Denver2)
* Qualcomm Kryo, Falkor
* Samsung Exynos M1 (Mongoose), M2 (Mongoose)

ARMv8.1-A|

| ARMv8.1-A
compatible|

* Cavium ThunderX2

|

ARMv8.2-A|

| Cortex-A55|

* Samsung Exynos 850
* UNISOC SC9863/A, T603

|

Cortex-A75|

* Qualcomm Snapdragon 670, 710, 712,  845, 850
* Samsung Exynos 9820, 9825
* MediaTek MT6769H/T/V/Z, MT6768, MT6779V
* UNISOC T310, T606, T610, T616, T618, T619, T700, T710, T740

Cortex-A76|

* Google Tensor
* HiSilicon Kirin 810, 820, 980, 985, 990
* Qualcomm Snapdragon 480(+), 675, 678, 720G, 730(G), 732G, 765(G), 768G, 855(+) and 860, 7c, 7c Gen 2, 8c, 8cx and 8cx Gen 2
* Microsoft SQ1 and SQ2
* MediaTek MT6781, MT6785V, MT6789, MT6833V/P, MT6853V/T, MT6873, MT6875, Dimensity 6020, 6080, 6100+, MT8192
* Samsung Exynos 990
* UNISOC T760, T770

Cortex-A77|

* MediaTek Dimensity 1000(+)
* Qualcomm  Snapdragon 690,  750G,  865(+) and 870
* HiSilicon Kirin 9000
* Samsung Exynos 880, 980

Cortex-A78|

* Google Tensor G2
* MediaTek MT6877, MT6878, MT6879, MT6891, MT6893, Dimensity 7020, 7030, 7050, 8000, 8020, 8050, 8100, 8200, Kompanio 900T, 1200, 1380, 1300T
* Qualcomm Snapdragon 4 Gen 1, 4 Gen 2, 695, 6 Gen 1, 778G(+), 780G, 782G, 888(+)
* Samsung Exynos 1080, 1280, 1330, 1380, 2100

Cortex-X1|

* Google Tensor, Tensor G2
* Qualcomm  Snapdragon 888(+)
* Samsung Exynos 2100

Neoverse N1|

* Ampere Altra, Altra Max
* AWS Graviton2

Others|

* Cortex-A65, Cortex-A65AE, Cortex-A76AE, Cortex-A78C, Cortex-X1C, Neoverse E1

ARMv8.2-A
compatible|

* Apple A11
* Fujitsu A64FX
* HiSilicon TaiShan v110
* Nvidia Tegra Xavier (Carmel)
* Samsung Exynos M3 (Meerkat), M4 (Cheetah), M5 (Lion)

ARMv8.3-A|

| ARMv8.3-A
compatible|

* Apple A12, A12X/A12Z, S4, S5
* Marvell ThunderX3

|

ARMv8.4-A|

| Neoverse V1|

* AWS Graviton3

|

ARMv8.4-A
compatible|

* Apple A13, S6, S7, S8

ARMv8.5-A|

| Others|

* Neoverse N2

|

ARMv8.5-A
compatible|

* Apple A14, A15, A16, M1, M2, M3

ARMv9-A|

| Cortex-A510|

* MediaTek Dimensity 7200, 9000/9000+, 9200
* Qualcomm Snapdragon 7 Gen 1, 7+ Gen 2, 8(+) Gen 1, 8 Gen 2
* Samsung Exynos 2200

|

Cortex-A520|

* Qualcomm Snapdragon 8 Gen 3

Cortex-A710|

* MediaTek Dimensity 9000/9000+
* Qualcomm Snapdragon 7 Gen 1, 7+ Gen 2, 8(+) Gen 1, 8 Gen 2
* Samsung Exynos 2200

Cortex-A715|

* MediaTek Dimensity 7200, 9200
* Qualcomm Snapdragon 8 Gen 2

Cortex-A720|

* MediaTek Dimensity 9300
* Qualcomm Snapdragon 8 Gen 3

Cortex-X2|

* MediaTek Dimensity 9000/9000+
* Qualcomm Snapdragon 7+ Gen 2, 8(+) Gen 1
* Samsung Exynos 2200

Cortex-X3|

* Google Tensor G3
* MediaTek Dimensity 9200/9200+
* Qualcomm Snapdragon 8 Gen 2

Cortex-X4|

* MediaTek Dimensity 9300
* Qualcomm Snapdragon 8 Gen 3

Neoverse V2|

* Nvidia Grace

* v
* t
* e

Embedded ARM-based chips

* ARM Holdings
* ARM architecture family
* List of ARM cores
* ARM Cortex-A
* ARM Cortex-R
* ARM Cortex-M
* List of ARM Cortex-M development tools

Embedded
microcontrollers|

| Cortex-M0|

* Cypress PSoC 4000, 4100, 4100M, 4200, 4200DS, 4200L, 4200M
* Infineon XMC1000
* Nordic nRF51
* NXP LPC1100, LPC1200
* nuvoTon NuMicro
* Sonix SN32F700
* STMicroelectronics STM32 F0
* Toshiba TX00
* Vorago VA108x0

|

Cortex-M0+|

* Cypress PSoC 4000S, 4100S, 4100S+, 4100PS, 4700S, FM0+
* Holtek HT32F52000
* Microchip (Atmel) SAM C2, D0, D1, D2, DA, L2, R2, R3
* NXP LPC800, LPC11E60, LPC11U60
* NXP (Freescale) Kinetis E, EA, L, M, V1, W0
* Raspberry Pi RP2040
* Renesas Synergy S1
* Silicon Labs (Energy Micro) EFM32 Zero, Happy
* STMicroelectronics STM32 L0

Cortex-M1|

* Altera FPGAs Cyclone-II, Cyclone-III, Stratix-II, Stratix-III
* Microsemi (Actel) FPGAs Fusion, IGLOO/e, ProASIC3L, ProASIC3/E
* Xilinx FPGAs Spartan-3, Virtex-2-3-4

Cortex-M3|

* Actel SmartFusion, SmartFusion 2
* Analog Devices ADuCM300
* Cypress PSoC 5000, 5000LP, FM3
* Fujitsu FM3
* Holtek HT32F
* Microchip (Atmel) SAM 3A, 3N, 3S, 3U, 3X
* NXP LPC1300, LPC1700, LPC1800
* ON Semiconductor Q32M210
* Silicon Labs Precision32
* Silicon Labs (Energy Micro) EFM32 Tiny, Gecko, Leopard, Giant
* STMicroelectronics STM32 F1, F2, L1
* Texas Instruments F28, LM3, TMS470, OMAP 4
* Toshiba TX03

Cortex-M4|

* Microchip (Atmel) SAM 4L, 4N, 4S
* NXP (Freescale) Kinetis K, W2
* Renesas RA4W1, RA6M1, RA6M2, RA6M3, RA6T1

Cortex-M4F|

* Cypress 6200, FM4
* Infineon XMC4000
* Microchip (Atmel) SAM 4C, 4E, D5, E5, G5
* Microchip CEC1302
* Nordic nRF52
* NXP LPC4000, LPC4300
* NXP (Freescale) Kinetis K, V3, V4
* Renesas Synergy S3, S5, S7
* Silicon Labs (Energy Micro) EFM32 Wonder
* STMicroelectronics STM32 F3, F4, L4, L4+, WB
* Texas Instruments LM4F/TM4C, MSP432
* Toshiba TX04

Cortex-M7F|

* Microchip (Atmel) SAM E7, S7, V7
* NXP (Freescale) Kinetis KV5x
* STMicroelectronics STM32 F7, H7

Cortex-M23|

* Microchip (Atmel) SAM L10, L11
* Renesas RA2E1, RA2L1, RA2E2, RA2A1

Cortex-M33|

* Renesas RA4M2, RA4M3, RA4E1, RA6M4, RA6M5, RA6E1, RA6T2

Real-time
microcontrollers|

| Cortex-R4F|

* Texas Instruments RM4, TMS570
* Renesas RZ/T1

|

Cortex-R5F|

* Scaleo OLEA
* Texas Instruments RM57
* Xilinx ZynqMP
* Renesas RZ/T2M

* v
* t
* e

Classic ARM-based chips

* ARM Holdings
* ARM architecture family
* List of ARM cores
* ARM Cortex-A
* ARM Cortex-R
* ARM Cortex-M
* List of ARM Cortex-M development tools

Classic
processors|

| ARM7|

* Atmel SAM7L, SAM7S, SAM7SE, SAM7X, SAM7XC, AT91CAP7, AT91M, AT91R
* Cirrus Logic PS7xxx, EP7xxx
* Mediatek MT62xx
* NXP LPC2100, LPC2200, LPC2300, LPC2400, LH7
* STMicroelectronics STR7

|

ARM9|

* Aspeed AST2400
* Atmel SAM9G, SAM9M, SAM9N, SAM9R, SAM9X, SAM9XE, SAM926x, AT91CAP9
* Cirrus Logic EP9xxx
* Freescale i.MX1x, i.MX2x
* Nuvoton NUC900
* NXP LPC2900, LPC3000, LH7A
* Philips Nexperia PNX4008
* Rockchip RK27xx, RK28xx
* Samsung S3C24xx
* STMicroelectronics Nomadik STn881x
* STMicroelectronics STR9
* Texas Instruments OMAP 1, AM1x, DaVinci
* VIA WonderMedia WM8505/8650
* ZiiLABS ZMS-05

ARM11|

* Broadcom BCM2835
* Cavium CNS3xxx
* Freescale i.MX3x
* Infotmic IMAPX210/220
* Mindspeed Comcerto 1000
* Nvidia Tegra APX, 6xx
* Qualcomm MSM7000, Snapdragon S1
* Samsung S3C64xx, S5P64xx
* ST-NXP Wireless Nomadik STn882x
* Telechips TCC8902
* Texas Instruments OMAP 2
* VIA WonderMedia WM87x0

ARMv2a
compatible|

* Amber (open FPGA core)

ARMv4
compatible|

* Faraday FA526, FA626
* DEC/Intel StrongARM

ARMv5TE
compatible|

* Intel/Marvell XScale
* Marvell Sheeva, Feroceon, Jolteon, Mohawk
* Faraday FA606TE, FA616TE, FA626TE, FA726TE

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