Winbond

Taiwanese flash memory manufacturer

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Winbond Electronics Corporation
華邦電子公司

Company type| Corporation
Industry| Semiconductors
Founded| 1987; 38 years ago (1987)
Headquarters| Taichung, Taiwan

Key people

| Arthur Yu-Cheng Chiao
(Chairman & CEO)
Tung-Yi Chan
(President)
Products|

* Mobile DRAM
* Specialty DRAM
* Flash memory

Website| www.winbond.com
A desktop PC Super I/O, based on the Winbond chip A Winbond controller

Winbond Electronics Corporation (Chinese: 華邦電子公司; pinyin: Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.

Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.[citation needed]

## History

[edit]

Winbond was established in 1987 in Hsinchu Science Park in Taiwan.[1][2] Its founder came from the Industrial Technology Research Institute.[3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant.[4]

In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers.[5]

Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995.[6]

Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing.[7] By 2002 Winbond had 4,000 employees.[1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.[8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM.[9]

The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.[citation needed]

In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda.[10]

In 2019 Karamba Security partnered with Winbond to make secure embedded flash products.[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.[12]

## See also

[edit]

* List of semiconductor fabrication plants
* List of companies of Taiwan

## References

[edit]

1. ^ a b Saperstein, Jeff; Rouach, Daniel (2002). Creating Regional Wealth in the Innovation Economy: Models, Perspectives, and Best Practices. FT Press. p. 225\. ISBN 978-0-13-065415-1.
2. ^ Jennex, Murray E. (2008). Knowledge Management: Concepts, Methodologies, Tools, and Applications. IGI Global. ISBN 978-1-59904-934-2.
3. ^ Misa, Thomas J.; Brey, Philip; Feenberg, Andrew (2003). Modernity and Technology. MIT Press. p. 350\. ISBN 978-0-262-63310-9.
4. ^ Pan, Joshua Jih (1999). J.J. Pan and Partners: Selected and Current Works. Images Publishing. pp. 210–211\. ISBN 978-1-86470-058-9.
5. ^ Corcoran, Cate (1992-07-27). "Winbond gives HP another notch in its PA-RISC belt". InfoWorld. p. 30. Retrieved 2024-05-15.
6. ^ LaPedus, Mark (October 30, 1995). "Winbond Plays It Out With Symphony". Electronic Buyers' News. CMP Publications: 3. ProQuest 228140765.
7. ^ Tran, Mark (1999-09-21). "China offers aid after Taiwan quake". The Guardian. ISSN 0261-3077. Retrieved 2024-05-15.
8. ^ Gupta, Jatinder N.D.; Sharma, Sushil Kumar (2004). Creating Knowledge Based Organizations. Idea Group Inc (IGI). p. 291\. ISBN 978-1-59140-162-9.
9. ^ Png, Ivan (2013). Managerial Economics (4th ed.). Routledge. ISBN 978-1-136-29757-1.
10. ^ "Winbond's innovative DRAM design and the legacy of Qimonda". EDN. 2010-08-12. Retrieved 2024-05-15.
11. ^ Lynn, Alex (2019-12-02). "Winbond and Karamba Security partner for embedded cyber security". www.electronicspecifier.com. Retrieved 2024-05-15.
12. ^ Fowle, Harry (2023-02-17). "Winbond joins UCIe Consortium to support chiplet interface standardisation". www.electronicspecifier.com. Retrieved 2024-05-15.

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Electronics industry in Taiwan

Semiconductor|

* Alchip
* ALi
* ASIX
* Himax
* MediaTek
* Ralink
* PSMC
* Realtek
* SiS
* Taiwan Semi
* TSMC
* UMC
* VIS
* VIA Technologies
* Winbond

SiP design|

* AOC International
* Himax
* MediaTek
* Ralink
* Microtek
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Other|

* Accton
* Acer
* ADATA
* Antec
* Apacer
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* Delta
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* DrayTek
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* ECS
* Foxconn
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* HTC
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* In Win Development
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* PowerColor
* QNAP
* Sampo Corporation
* Sea Sonic
* Senao Networks
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Defunct|

* DTK Computer
* EPoX
* Universal Abit
* Wintek

* Category

Authority control databases |

* ISNI

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