Zig-zag in-line package

Type of integrated circuit packaging

Zig-zag in-line package

The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs), but are still in use. The quad in-line package uses a similar staggered semiconductor package design.

High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a heatsink). These zig-zag packages include variations on the TO220 such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in multi-leaded power packages like TDA2002/2003/2020/2030 and L200.[1]

* ZIP chips in ZIP sockets

* ZIP chips

As for computers, dynamic RAM ZIP chips are now only to be found in obsolete computers, some of these are:

* Amiga 500 expansion packs
* Amiga 3000 on-board memory and some expansion boards
* Commodore CDTV on-board memory
* Acorn Archimedes 300 and 400 series on-board memory
* Acorn Archimedes A3010 and A3020

## See also[edit]

* Types of chip carriers – list of chip package types

## References[edit]

1. ^ http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/CD00000053.pdf[dead link]

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Semiconductor packages

Single diode|

* DO-201 (DO-27)
* DO-204 (DO-7 / DO-26 / DO-35 / DO-41)
* DO-213 (MELF / SOD-80 / LL34)
* DO-214 (SMA / SMB / SMC)
* SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)

3...5-pin|

* SOT / TSOT
* TO-3 (TH / Panel)
* TO-5 (TH)
* TO-8 (TH)
* TO-18 (TH)
* TO-39 (TH)
* TO-66 (TH / Panel)
* TO-92 (TH)
* TO-126 (TH / Panel)
* TO-202 (TH / Panel)
* TO-220 (TH / Panel)
* TO-247 (TH / Panel)
* TO-251 (IPAK) (SMT)
* TO-252 (DPAK) (SMT)
* TO-262 (I2PAK) (SMT)
* TO-263 (D2PAK) (SMT)
* TO-268 (D3PAK) (SMT)
* TO-273 (Super-220) (SMT)
* TO-274 (Super-247) (SMT)

Single row|

* SIP / SIL

Dual row|

* DFN
* DIP / DIL
* Flat Pack
* MSOP
* SO / SOIC
* SOP / SSOP
* TSOP / HTSOP
* TSSOP / HTSSOP
* ZIP

Quad row|

* LCC
* QIP / QIL
* PLCC
* QFN
* QFP
* QUIP / QUIL

Grid array|

* BGA
* eWLB
* LGA
* PGA

Wafer|

* COB
* COF
* COG
* CSP
* Flip Chip
* PoP
* QP
* UICC
* WL-CSP / WLP

Related topics|

* Electronic packaging
* Integrated circuit packaging
* List of integrated circuit packaging types
* Printed circuit board
* Surface-mount technology
* Through-hole technology

It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.

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