Semiconductor device fabrication

• Engineering:Semiconductor device fabrication

A

• Engineering:Advanced silicon etching
• Engineering:AI-driven design automation
• Physics:Airgap (microelectronics)
• Company:Ampleon
• Physics:Atomic layer deposition
• Physics:Atomic layer etching

B

• Engineering:B-staging
• Engineering:Back end of line
• Engineering:Backside power delivery
• Chemistry:Borophosphosilicate glass

C

• Engineering:Chalcogenide chemical vapour deposition
• Chemistry:Chemical vapor deposition
• Engineering:Chemical-mechanical planarization
• Engineering:Chemical-mechanical polishing
• Biography:Alfred Y. Cho
• Physics:Close-space sublimation
• Engineering:Common Platform (semiconductors)
• Engineering:Alexander Coucoulas
• Engineering:Cross section (electronics)

D

• Chemistry:Dark current spectroscopy
• Physics:Deal–Grove model
• Engineering:Device under test
• Engineering:Dicing tape
• Engineering:Die preparation
• Engineering:Diffusion barrier
• Physics:Doping (semiconductor)
• Engineering:Drive-level capacitance profiling

E

• Electron beam-induced current
• Physics:Electrostatic spray-assisted vapour deposition
• Physics:Epitaxy
• Physics:Evaporation (deposition)

F

• Engineering:Fabless manufacturing
• Engineering:Front end of line
• Focused ion beam
• Physics:Foundry model
• Engineering:FOUP

G

• Engineering:Gate count
• Physics:Glossary of microelectronics manufacturing terms

H

• Engineering:Hardmask
• Physics:Homotopotaxy
• Engineering:High-Speed SECS Message Services
• Physics:Hydride vapour phase epitaxy

I

• Engineering:Integrated circuit packaging
• Engineering:Integrated device manufacturer
• Physics:Ion beam
• Engineering:Ion beam lithography
• Chemistry:Ion beam mixing
• Physics:Ion implantation
• Physics:Ion layer gas reaction

K

• Physics:Kinetic Monte Carlo surface growth method

L

• Engineering:Lateral epitaxial overgrowth and pendeo-epitaxy
• Engineering:Lift-off (microtechnology)
• Engineering:List of semiconductor fabrication plants
• Chemistry:Low-energy plasma-enhanced chemical vapor deposition

M

• Physics:Metal-induced crystallization
• Physics:Metalorganic vapour-phase epitaxy
• Physics:Microfabrication
• Engineering:Microtechnology
• Physics:Molecular layer deposition
• Engineering:MOSIS
• Engineering:Multi-project wafer service
• Biography:Bruno Murari

N

• Engineering:Negative-bias temperature instability
• Chemistry:Novolak

O

• Physics:Ohmic contact
• Engineering:Overlay control

P

• Engineering:Package on a package
• Engineering:Package on package
• Engineering:Passivation
• Chemistry:Phenol formaldehyde resin
• Engineering:Phosphosilicate glass
• Physics:Physical vapor deposition
• Engineering:Planar process
• Engineering:Plasma ashing
• Engineering:Plasma cleaning
• Chemistry:Plasma-enhanced chemical vapor deposition
• Physics:Plasma-immersion ion implantation
• Chemistry:Polycide
• Engineering:Product binning
• Engineering:Product engineering
• Physics:Pulsed laser deposition

R

• Engineering:Rapid thermal processing
• Engineering:Reactive-ion etching
• Engineering:Redistribution layer

S

• Chemistry:Salicide
• Organization:SEMI
• Engineering:Semiconductor industry in China
• Engineering:Semiconductor industry in Taiwan
• Engineering:Semiconductor intellectual property core
• Physics:Shallow trench isolation
• Physics:Silicon on insulator
• Physics:Silicon on sapphire
• Physics:Smart cut
• Physics:Spin coating
• Engineering:Spreading resistance profiling
• Physics:Sputter deposition
• Engineering:Stepper
• Engineering:Substrate mapping
• Engineering:Surface activated bonding
• Physics:Surface growth
• Engineering:Symposia on VLSI Technology and Circuits

T

• Chemistry:Tetrakis(dimethylamido)titanium
• Physics:Thermal laser epitaxy
• Engineering:Thermosonic bonding
• Engineering:Three-dimensional integrated circuit
• Engineering:Through-silicon via
• Chemistry:Titanium nitride

U

• Physics:Ultra-high-purity steam for oxidation and annealing
• Chemistry:Ultrapure water
• Engineering:Ultraviolet thermal processing

V

• Virtual metrology

W

• Engineering:Wafer backgrinding
• Engineering:Wafer fabrication
• Engineering:Wafer fabrication equipment
• Engineering:Wafer-scale integration
• Engineering:WaferCatalyst
• Physics:Wafering
• Engineering:Wedge bonding
• Engineering:Wire bonding

Z

• Chemistry:Zyron