Solder alloys
Topic: Chemistry
From HandWiki - Reading time: 24 min
Soldering copper pipes using a propane torch and a lead-free solder
Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ones are listed below. Since early 2000s the use of lead in solder alloys is discouraged by several governmental guidelines in the European Union, Japan and other countries,[1] such as Restriction of Hazardous Substances Directive and Waste Electrical and Electronic Equipment Directive.
Solder alloys
| Composition | Melting point (°C) | Toxic | Eutectic | Comments | |
|---|---|---|---|---|---|
| Solidus | Liquidus | ||||
| Sn 50Zn 49Cu 1 |
200 | 300[2] | No | No | Galvanite Lead-free galvanizing solder formulation designed specifically for high quality repairs to galvanized steel surfaces. Simple, effective and easy to use, in both manufacturing and field applications. Metallurgically bonds to the steel, for a seamless protective barrier.[2] |
| Sn 95.5Cu 4Ag 0.5 |
226 | 260[3] | No | No | KappFree provides good joint strength, vibration resistance, and thermal cycle fatigue resistance in both piping and electrical products as opposed to tin-lead solders. Higher working temperature. Wets well to brass, copper, and stainless steel. Good electrical conductivity.[3] |
| Sn 90Zn 7Cu 3 |
200 | 222[4] | No | No | Kapp Eco-Babbitt[4] Commonly used in capacitor manufacturing as protective coating to shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor, to prevent current and charge leakage out of and within the layers of the capacitor, and to prevent the development of electron flows within the coating material itself, that would diminish capacitor performance, coating, and capacitor life.[4] |
| Pb 90Sn 10 |
268 275 |
302[5] 302[6] |
Pb | No | Sn10, UNS L54520, ASTM10B. Balls for CBGA components, replaced by Sn 95.5Ag 3.9Cu 0.6.[7] Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those.[8] Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.[9] Has low thermal EMF, can be used as an alternative to Cd 70 where parasitic thermocouple voltage has to be avoided.[10] |
| Pb 88Sn 12 |
254 | 296[9] | Pb | No | Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder. |
| Pb 85Sn 15 |
227 | 288[9] | Pb | No | Used for coating tubes and sheets and fabrication of car radiators. Body solder. |
| Pb 80Sn 20 |
183 | 280[6] | Pb | No | Sn20, UNS L54711. Used for coating radiator tubes for joining fins.[9] |
| Pb 80Sb 15Sn 5 |
300 | Pb | White Metal Capping. Used for locking mineshaft winding ropes into their tapered end sockets or 'capels'.[11] | ||
| Pb 75Sn 25 |
183 | 266[5] | Pb | No | Crude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.[9] |
| Pb 70Sn 30 |
185 183 |
255 257[6] |
Pb | No | Sn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering.[12] Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.[9] |
| Pb 68Sn 32 |
253 | Pb | No | "Plumber solder", for construction plumbing works[13] | |
| Pb 68Sn 30Sb 2 |
185 | 243[6] | Pb | No | Pb68 |
| Sn 30Pb 50Zn 20 |
177 | 288[14] | Pb | No | Kapp GalvRepair Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been used for cast Iron and galvanized surface repair.[14] |
| Sn 33Pb 40Zn 28 |
230 | 275[14] | Pb | No | Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been used for cast Iron and galvanized surface repair.[14] |
| Pb 67Sn 33 |
187 | 230 | Pb | No | PM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additives |
| Pb 65Sn 35 |
183 | 250[6] | Pb | No | Sn35. Used as a cheaper alternative of Pb 60Sn 40 for wiping and sweating joints.[9] |
| Pb 60Sn 40 |
183 | 238[5] 247[6] |
Pb | No | Sn40, UNS L54915. For soldering of brass and car radiators.[12] For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems.[9] |
| Pb 55Sn 45 |
183 | 227[9] | Pb | No | For soldering radiator cores, roof seams, and for decorative joints. |
| Sn 50Pb 50 |
183 | 216[5] 212[6] |
Pb | No | Sn50, UNS L55030. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below ?150 °C.[15][13] Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those.[8] For wiping and assembling plumbing joints for non-potable water.[9] |
| Sn 50Pb 48.5Cu 1.5 |
183 | 215[16] | Pb | No | Savbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires.[17] |
| Sn 60Pb 40 |
183 | 190[5] 188[6] |
Pb | Near | Sn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[8] Slightly cheaper than Sn 63Pb 37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn 63Pb 37.[17] |
| Sn 60Pb 38Cu 2 |
183 | 190[6][18] | Pb | Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. | |
| Sn 60Pb 39Cu 1 |
Pb | No | |||
| Sn 62Pb 38 |
183 | Pb | Near | "Tinman's solder", used for tinplate fabrication work.[13] | |
| Sn 63Pb 37 |
183[19] | Pb | Yes | Sn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of the most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[8] Sn 60Pb 40 is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than Sn 60Pb 40.[17] | |
| Sn 63Pb 37P 0.0015- 0.04 |
183[20] | Pb | Yes | Sn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam. | |
| Sn 62Pb 37Cu 1 |
183[18] | Pb | Yes | Similar to Sn 63Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. | |
| Sn 70Pb 30 |
183 | 193[5] | Pb | No | Sn70 |
| Sn75Pb25 | 183 | 238[21] | Pb | No | |
| Sn 90Pb 10 |
183 | 213[6] | Pb | No | formerly used for joints in food industry |
| Sn 95Pb 5 |
238 | Pb | No | plumbing and heating | |
| Pb 92Sn 5.5Ag 2.5 |
286 | 301[18] | Pb | No | For higher-temperature applications. |
| Pb 80Sn 12Sb 8 |
Pb | No | Used for soldering iron and steel[13] | ||
| Pb 80Sn 18Ag 2 |
252 | 260[6] | Pb | No | Used for soldering iron and steel[13] |
| Pb 79Sn 20Sb 1 |
184 | 270 | Pb | No | Sb1 |
| Pb 55Sn 43.5Sb 1.5 |
Pb | No | General purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals.[13] | ||
| Sn 43Pb 43Bi 14 |
144 | 163[5] | Pb | No | Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth.[22] Useful for step soldering. |
| Sn 46Pb 46Bi 8 |
120 | 167[6] | Pb | No | Bi8 |
| Bi 52Pb 32Sn 16 |
96 | Pb | yes? | Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.[22] | |
| Bi 46Sn 34Pb 20 |
100 | 105[6] | Pb | No | Bi46 |
| Sn 62Pb 36Ag 2 |
179[5] | Pb | Yes | Sn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn 60Pb 40 or Sn 63Pb 37. Crystals of Ag 3Sn may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics.[15][17][22] Not recommended for gold.[8] General-purpose. | |
| Sn 62.5Pb 36Ag 2.5 |
179[5] | Pb | Yes | ||
| Pb 88Sn 10Ag 2 |
268 267 |
290[5] 299[23] |
Pb | No | Sn10, Pb88. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold.[8] Forms a eutectic phase, not recommended for operation above 120 °C. |
| Pb 90Sn 5Ag 5 |
292[5] | Pb | Yes | ||
| Pb 92.5Sn 5Ag 2.5 |
287 299 |
296[5] 304[6] |
Pb | No | Pb93. |
| Pb 93.5Sn 5Ag 1.5 |
296 305 |
301[5] 306[6] |
Pb | No | Pb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb 95Sn 5.[17] |
| Pb 95.5Sn 2Ag 2.5 |
299 | 304[5] | Pb | No | |
| In 97Ag 3 |
143[24] | No | Yes | Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices. | |
| In 90Ag 10 |
143 | 237[25] | No | No | Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics. |
| In 75Pb 25 |
156 | 165[8] | Pb | No | Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures.[8] |
| In 70Pb 30 |
160 165 |
174[5] 175[6][26] |
Pb | No | In70. Suitable for gold, low gold-leaching. Good thermal fatigue properties. |
| In 60Pb 40 |
174 173 |
185[5] 181[6] |
Pb | No | In60. Low gold-leaching. Good thermal fatigue properties. |
| In 50Pb 50 |
180 178 |
209[8] 210[6] |
Pb | No | In50. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure.[22] On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic.[27] Less gold dissolution and more ductile than lead-tin alloys.[8] Good thermal fatigue properties. |
| In 50Sn 50 |
118 | 125[28] | No | No | Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder.[29] |
| In 70Sn 15Pb 9.6Cd 5.4 |
125[30] | Cd, Pb | |||
| Pb 75In 25 |
250 240 |
264[8] 260[31] |
Pb | No | In25. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies.[27] Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy.[8] |
| Sn 70Pb 18In 12 |
162[5] | Pb | Yes | General purpose. Good physical properties. | |
| 154 | 167[32] | ||||
| Sn 37.5Pb 37.5In 25 |
134 | 181[8] | Pb | No | Good wettability. Not recommended for gold.[8] |
| Pb 90In 5Ag 5 |
290 | 310[5] | Pb | No | |
| Pb 92.5In 5Ag 2.5 |
300 | 310[5] | Pb | No | UNS L51510. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used.. |
| Pb 92.5In 5Au 2.5 |
300 | 310[6] | Pb | No | In5 |
| Pb 94.5Ag 5.5 |
305 304 |
364[6] 343[33] |
Pb | No | Ag5.5, UNS L50180 |
| Pb 95Ag 5 |
305 | 364[34] | Pb | No | |
| Pb 97.5Ag 2.5 |
303[5] 304[6] |
Pb | Yes | Ag2.5, UNS L50132. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints.[35] Torch solder. | |
| 304 | 579[36] | ||||
| Sn 97.5Pb 1Ag 1.5 |
305 | Pb | Yes | Important for hybrid circuits assembly.[15] | |
| Pb 97.5Ag 1.5Sn 1 |
309[5] | Pb | Yes | Ag1.5, ASTM1.5S. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable.[12] Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold.[8] Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures. | |
| Pb 54Sn 45Ag 1 |
177 | 210 | Pb | exceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel[12] | |
| Pb 96Ag 4 |
305 | Pb | high-temperature joints[12] | ||
| Pb 96Sn 2Ag 2 |
252 | 295[6] | Pb | Pb96 | |
| Sn 61Pb 36Ag 3 |
205[37] | Pb | [15] Often referred as POS61 (Russian: ПОС61) in Russia (silver may not be necessarily present). | ||
| Sn 56Pb 39Ag 5 |
Pb | [15] | |||
| Sn 98Ag 2 |
No | [15] | |||
| Sn 65Ag 25Sb 10 |
233 | No | Yes | Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder. | |
| Sn 96.5Ag 3.0Cu 0.5 |
217 | 220 218[6][38] |
No | Near | SAC305. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn 97Ag 3 alloy. Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. Weakens at thermal cycling, concern of whisker growth, large Ag 3Sn intermetallic platelet precipitates causing mechanical weakening and poor shock/drop performance. Tendency to creep.[39] |
| Sn 98.5Ag 1.0Cu 0.5 |
220 | 225 | No | Near | SAC105 alloy contains the least amount of silver among lead-free solders. It is compatible with all flux types and is relatively inexpensive; it exhibits good fatigue resistance, wetting and solder joint reliability |
| Sn 95.8Ag 3.5Cu 0.7 |
217 | 218 | No | Near | SN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn 96.5Ag 3.5 alloy (designated e.g. SN 96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. |
| Sn 95.6Ag 3.5Cu 0.9 |
217 | No | Yes | Determined by NIST to be truly eutectic. | |
| Sn 95.5Ag 3.8Cu 0.7 |
217[40] | No | Near | SN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn 96.2Ag 3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. | |
| Sn 95.25Ag 3.8Cu 0.7Sb 0.25 |
No | Preferred by the European IDEALS consortium for wave soldering. | |||
| Sn 95.5Ag 3.9Cu 0.6 |
217[41] | No | Yes | Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn 10Pb 90. Solder paste for rework of BGA boards.[7] Alloy of choice for general SMT assembly. | |
| Sn 95.5Ag 4Cu 0.5 |
217[42] | No | Yes | SAC405. Lead-Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications.[3] | |
| Sn 96.5Ag 3.5 |
221[5] | No | Yes | Sn 96, Sn 96.5, 96S. Fine lamellar structure of densely distributed Ag 3Sn. Annealing at 125 °C coarsens the structure and softens the solder.[7] Creeps via dislocation climb as a result of lattice diffusion.[43] Used as wire for hand soldering rework; compatible with SnCu 0.7, SnAg 3Cu 0.5, SnAg 3.9Cu 0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry.[7] Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[8] Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations.[17] High tin content allows absorbing significant amount of gold without embrittlement.[44] | |
| Sn 96Ag 4 |
221 | 229 | No | No | ASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing.[12] Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[8] |
| Sn 95Ag 5 |
221 | 254[45] | No | No | Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless.[45] |
| Sn 94Ag 6 |
221 | 279[45] | No | No | Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless.[45] |
| Sn 93Ag 7 |
221 | 302[45] | No | No | Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 31,000 psi on Stainless.[45] Audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance.[46] |
| Sn 95Ag 4Cu 1 |
No | ||||
| Sn | 232 | No | Pure | Sn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying.[12] Susceptible to tin pest. | |
| Sn 99.3Cu 0.7 |
228[1] | No | Yes | Sn99Cu1. Also designated as Sn 99Cu 1. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed Cu 6Sn 5.[1][47] Forms large dendritic ß-tin crystals in a network of eutectic microstructure with finely dispersed Cu 6Sn 5. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest.[43] Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modified or nickel stabilized.[48] | |
| Sn 99.3Cu 0.7Ni 0.05Ge 0.009 |
227[49] | Yes | Sn100C, a lead-free silver-free nickel-stabilized alloy. Similar to Sn99Cu1. The nickel content lowers copper erosion and promotes shiny solder fillet. The presence of germanium promotes flow and reduces dross formation. Performance similar to SAC alloys at lower cost. Dross formation rate comparable to lead-tin alloys. | ||
| Sn 99.3Cu 0.7Ni?Bi? |
227[50] | Yes | K100LD, a lead-free silver-free nickel-stabilized alloy, with low dissolving (LD) of copper. Proprietary of Kester. Similar to Sn99Cu1. The nickel content lowers copper erosion and promotes shiny solder fillet. Bismuth acts in synergy with nickel to further reduce copper dissolution and reduces surface tension. Performance similar to SAC alloys at lower cost. K100LDa has 0.2% copper, used to refill wave soldering pots to counteract copper buildup. Lower than optimal nickel content to avoid patents?[51] | ||
| Sn 99Cu 0.7Ag 0.3 |
217 | 228[52] | No | No | SCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn 96.2Ag 3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. |
| Sn 97Cu 3 |
227 232 |
250[53] 332[9] |
No | For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing. | |
| Sn 97Cu 2.75Ag 0.25 |
228 | 314[9] | No | High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors. | |
| Zn 100 |
419 | No | Pure | For soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.[54] | |
| Bi 100 |
271 | No | Pure | Used as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint.[29] | |
| Sn 91Zn 9 |
199[55] | No | Yes | KappAloy9 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Best solder for Aluminum wire to Copper busses or Copper wire to Aluminum busses or contacts.[55] UNS#: L91090 | |
| Sn 85Zn 15 |
199 | 260[55] | No | No | KappAloy15 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Has a wide plastic range this makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools.[55] |
| Zn 95Al 5 |
382 | No | Yes | For soldering aluminium. Good wetting.[54] | |
| Sn 91.8Bi 4.8Ag 3.4 |
211 | 213[56] | No | No | Do not use on lead-containing metallizations.[57] |
| Sn 70Zn 30 |
199 | 316[55] | No | No | KappAloy30 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.[55] |
| Sn 80Zn 20 |
199 | 288[55] | No | No | KappAloy20 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.[55] |
| Sn 60Zn 40 |
199 | 343[55] | No | No | KappAloy40 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.[55] |
| Pb 63Sn 35Sb 2 |
185 | 243[6] | Pb | No | Sb2 |
| Pb 63Sn 34Zn 3 |
170 | 256 | Pb | No | Poor wetting of aluminium. Poor corrosion rating.[35] |
| Pb 92Cd 8 |
310? | Cd, Pb | ? | For soldering aluminium.[58][59] | |
| Sn 48Bi 32Pb 20 |
140 | 160[18] | Pb | No | For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. |
| Sn 89Zn 8Bi 3 |
191 | 198 | No | Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this.[60] | |
| Sn 83.6Zn 7.6In 8.8 |
181 | 187[61] | No | No | High dross due to zinc.[62] |
| Sn 86.5Zn 5.5In 4.5Bi 3.5 |
174 | 186[63] | No | No | Lead-free. Corrosion concerns and high drossing due to zinc content. |
| Sn 86.9In 10Ag 3.1 |
204 | 205[64] | No | Potential use in flip-chip assembly, no issues with tin-indium eutectic phase. | |
| Sn 95Ag 3.5Zn 1Cu 0.5 |
221[60] | No | No | ||
| Sn 95Sb 5 |
235 232 |
240[5][6] | No | No | Sb5, ASTM95TA. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg 3.5. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn.[43] High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications.[12] Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs. |
| Sn 97Sb 3 |
232 | 238[65] | No | No | |
| Sn 99Sb 1 |
232 | 235[66] | No | No | |
| Sn 99Ag 0.3Cu 0.7 |
No | ||||
| Sn 96.2Ag 2.5Cu 0.8Sb 0.5 |
217[6] | 225 | No | Ag03A. Patented by AIM alliance. | |
| Sn 88In 8.0Ag 3.5Bi 0.5 | |||||
| Bi 57Sn 42Ag 1 |
137 139 |
139 140[67] |
No | Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola. | |
| Bi 58Sn 42 |
138[5][8] | No | Yes | Bi58. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.[22] Low-temperature eutectic solder with high strength.[8] Particularly strong, very brittle.[5] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint.[60] Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance.[68] Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification.[29] | |
| Bi 58Pb 42 |
124 | 126[69] | Pb | ||
| In 80Pb 15Ag 5 |
142 149 |
149[6] 154[70] |
Pb | No | In80. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering. |
| Pb 60In 40 |
195 | 225[6] | Pb | No | In40. Low gold-leaching. Good thermal fatigue properties. |
| Pb 70In 30 |
245 | 260[6] | Pb | No | In30 |
| Sn 37.5Pb 37.5In 26 |
134 | 181[6] | Pb | No | In26 |
| Sn 54Pb 26In 20 |
130 140 |
154[6] 152[71] |
Pb | No | In20 |
| Pb 81In 19 |
270 260 |
280[6] 275[72] |
Pb | No | In19. Low gold-leaching. Good thermal fatigue properties. |
| In 52Sn 48 |
118 | No | Yes | In52. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing.[60] Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials. | |
| Sn 52In 48 |
118 | 131[5] | No | No | very low tensile strength |
| Sn 58In 42 |
118 | 145[73] | No | No | |
| Sn 51.2Pb 30.6Cd 18.2 |
145[74] | Cd, Pb | Yes | General-purpose. Maintains creep strength well. Unsuitable for gold. | |
| Sn 77.2In 20Ag 2.8 |
175 | 187[75] | No | No | Similar mechanical properties with Sn 63Pb 37, Sn 62Pb 36Ag 2 and Sn 60Pb 40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C. |
| In 74Cd 26 |
123[76] | Cd | Yes | ||
| In 66.7Bi 33.3 |
72.7 | ||||
| In 61.7Bi 30.8Cd 7.5 |
62[77] | Cd | Yes | ||
| Bi 47.5Pb 25.4Sn 12.6Cd 9.5In 5 |
57 | 65[78] | Cd, Pb | No | |
| Bi 48Pb 25.4Sn 12.8Cd 9.6In 4 |
61 | 65[79] | Cd, Pb | No | |
| Bi 49Pb 18Sn 15In 18 |
58 | 69[80] | Pb | No | |
| Bi 49Pb 18Sn 12In 21 |
58 | Pb | Yes | Cerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.[29] Also the ChipQuik desoldering alloy.[81] | |
| Bi 50.5Pb 27.8Sn 12.4Cd 9.3 |
70 | 73[82] | Cd, Pb | No | |
| Bi 50Pb 26.7Sn 13.3Cd 10 |
70 | Cd, Pb | Yes | Cerrobend. Used in low-temperature physics as a solder.[29] | |
| Bi 44.7Pb 22.6In 19.1Cd 5.3Sn 8.3 |
47 | Cd, Pb | Yes | Cerrolow 117. Used as a solder in low-temperature physics.[29] | |
| In 60Sn 40 |
113 | 122[5] | No | No | |
| In 51.0Bi 32.5Sn 16.5 |
60.5 | No | Yes | Field's metal | |
| Bi 49.5Pb 27.3Sn 13.1Cd 10.1 |
70.9 | Cd, Pb | Near | Lipowitz Metal | |
| Bi 50.0Pb 25.0Sn 12.5Cd 12.5 |
71 | Cd, Pb | Near | Wood's metal, mostly used for casting. | |
| Bi 50.0Pb 31.2Sn 18.8 |
97 | Pb | No | Newton's metal | |
| Bi 50Pb 28Sn 22 |
109 | Pb | No | Rose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling. | |
| Bi 56Sn 30In 14 |
79 | 91 | No | ChipQuik desoldering alloy, lead-free[83] | |
| Cd 95Ag 5 |
338 | 393[84] | Cd | No | KappTec General purpose solder that will join all solderable metals except Aluminum. High temperature, high strength solder. It is used in applications where alloys melting higher than soft solders are required, but the cost and strength of Silver-brazing alloys is not necessary.[84] |
| Cd 82.5Zn 17.5 | |||||
| Cd 70Zn 30 |
265 | 300[85] | Cd | No | Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.[85] |
| Cd 60Zn 40 |
265 | 316[85] | Cd | No | Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.[85] |
| Cd 78Zn 17Ag 5 |
249 | 316[86] | Cd | No | KappTecZ High temperature, high strength solder that may be used on most metals, but works extremely well on Aluminum, Copper and Stainless Steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals. Above its liquidus of 600 °F, this solder is extremely fluid and will penetrate the closest joints.[86] |
| Sn 40Zn 27Cd 33 |
176 | 260[87] | Cd | No | KappRad[87] Developed specifically to join and repair Aluminum and Aluminum/Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier.[87] |
| Zn 90Cd 10 |
265 | 399 | Cd | For soldering aluminium. Good wetting.[54] | |
| Zn 60Cd 40 |
265 | 335 | Cd | For soldering aluminium. Very good wetting.[54] | |
| Cd 70Sn 30 |
140 | 160[6] | Cd | No | Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics.[29] |
| Sn 50Pb 32Cd 18 |
145[6] | Cd, Pb | Cd18 | ||
| Sn 40Pb 42Cd 18 |
145[88] | Cd, Pb | Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. | ||
| Zn 70Sn 30 |
199 | 376 | No | No | For soldering aluminium. Excellent wetting.[35] Good strength. |
| Zn 60Sn 40 |
199 | 341 | No | No | For soldering aluminium. Good wetting.[54] |
| Zn 95Sn 5 |
382 | No | yes? | For soldering aluminium. Excellent wetting.[35] | |
| Sn 90Au 10 |
217[89] | No | Yes | ||
| Au 80Sn 20 |
280 | No | Yes | Au80. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature.[90] Forms a mixture of two brittle intermetallic phases, AuSn and Au 5Sn.[91] Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability.[27] One of the best materials for soldering in optoelectronic devices and components packaging. Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150 °C.[92] Good ductility. Also classified as a braze. | |
| Au 98Si 2 |
370 | 800[6] | No | Au98. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow. | |
| Au 96.8Si 3.2 |
370[6] | 363[93] | No | Yes | Au97.[90] AuSi 3.2 is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation.[47] |
| Au 87.5Ge 12.5 |
361 356[6] |
No | Yes | Au88. Used for die attachment of some chips.[5] The high temperature may be detrimental to the chips and limits reworkability.[27] | |
| Au 82In 18 |
451 | 485[6] | No | No | Au82. High-temperature, extremely hard, very stiff. |
| In 100 |
157 | No | Pure | In99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures.[94] Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron.[29] | |
| Sn 90.7Ag 3.6Cu 0.7Cr 5 |
217 | 1050[95] | No | No | C-Solder. Lead-free, low-temperature soldering alloy for joining of various carbon materials including carbon fibres and carbon nanotube fibres in both carbon-carbon and carbon-metal arrangements. Produces mechanically strong and electrically conductive bonds. Provides wetting of carbon[96] and other materials generally considered as difficult to solder, including aluminium, stainless steel, titanium, glass, and ceramics. |
Notes on the above table
In the Sn-Pb alloys, tensile strength increases with increasing tin content. Indium-tin alloys with high indium content have very low tensile strength.[5]
For soldering semiconductor materials, e.g. die attachment of silicon, germanium and gallium arsenide, it is important that the solder contains no impurities that could cause doping in the wrong direction. For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used.[35][97]
Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.
Properties
The thermal conductivity of common solders ranges from 30 to 400 W/(m·K), and the density from 9.25 to 15.00 g/cm3.[98][99]
| Material | Thermal conductivity[99] (W/m·K) |
Melting point[99] (°C) |
|---|---|---|
| Sn-37Pb (eutectic) | 50.9 | 183 |
| Sn-0.7Cu | 53[1] | 227 |
| Sn-2.8Ag-20.0In | 53.5 | 175–186 |
| Sn-2.5Ag-0.8Cu-0.5Sb | 57.26 | 215–217 |
| Pb-5Sn | 63 | 310 |
| Lead (Pb) | 35.0 | 327.3 |
| Tin (Sn) | 73.0 | 231.9 |
| Aluminum (Al) | 240 | 660.1 |
| Copper (Cu) | 393–401 | 1083 |
| FR-4 | 1.7 |
References
- ↑ 1.0 1.1 1.2 1.3 Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, and Lei Sun (2019). "Structure and properties of Sn-Cu lead-free solders in electronics packaging". Science and Technology of Advanced Materials 20 (1): 421–444. doi:10.1080/14686996.2019.1591168. PMID 31489052. Bibcode: 2019STAdM..20..421Z.
- ↑ 2.0 2.1 "Galvanite". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/galvanite-solder.php. Retrieved 23 October 2012.
- ↑ 3.0 3.1 3.2 "KappFree". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/kappfree-elec-solder.php. Retrieved 2 March 2015.
- ↑ 4.0 4.1 4.2 Kapp Alloy. "Kapp Eco Babbitt". http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=54254&component=catalog&catalog_id=18662. Retrieved 4 April 2013.
- ↑ 5.00 5.01 5.02 5.03 5.04 5.05 5.06 5.07 5.08 5.09 5.10 5.11 5.12 5.13 5.14 5.15 5.16 5.17 5.18 5.19 5.20 5.21 5.22 5.23 5.24 5.25 5.26 5.27 5.28 Charles A. Harper (2003). Electronic materials and processes. McGraw-Hill Professional. pp. 5–8. ISBN 978-0-07-140214-9. https://books.google.com/books?id=CQGPGwFuPRkC&pg=SA5-PA8.
- ↑ 6.00 6.01 6.02 6.03 6.04 6.05 6.06 6.07 6.08 6.09 6.10 6.11 6.12 6.13 6.14 6.15 6.16 6.17 6.18 6.19 6.20 6.21 6.22 6.23 6.24 6.25 6.26 6.27 6.28 6.29 6.30 6.31 6.32 6.33 6.34 6.35 6.36 6.37 "Solder Alloys". https://invacu.com/solder-alloys.
- ↑ 7.0 7.1 7.2 7.3 Sanka Ganesan; Michael Pecht (2006). Lead-free electronics. Wiley. p. 110. ISBN 978-0-471-78617-7. https://books.google.com/books?id=z4Ha0AYdon4C&pg=PA110.
- ↑ 8.00 8.01 8.02 8.03 8.04 8.05 8.06 8.07 8.08 8.09 8.10 8.11 8.12 8.13 8.14 8.15 8.16 8.17 8.18 Ray P. Prasad (1997). Surface mount technology: principles and practice. Springer. p. 385. ISBN 978-0-412-12921-6. https://books.google.com/books?id=IcxDPA2U6esC&pg=PA385.
- ↑ 9.00 9.01 9.02 9.03 9.04 9.05 9.06 9.07 9.08 9.09 9.10 9.11 SOLDER ALLOYS Selection Chart. (PDF). Retrieved 2010-07-06.
- ↑ Walt Kester James Bryant Walt Jung Scott Wurcer Chuck Kitchin (2005). "Ch. 4. Sensor Signal Conditioning". Op Amp Applications Handbook. Newnes/Elsevier. p. 4.49. ISBN 0-7506-7844-5. http://www.analog.com/library/analogDialogue/archives/39-05/Web_Ch4_final.pdf.
- ↑ T R Barnard (1959). "Winding Ropes and Guide Ropes". Mechanical Engineering. Coal Mining Series (2nd ed.). London: Virtue. pp. 374–375.
- ↑ 12.0 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Madara Ogot; Gul Okudan-Kremer (2004). Engineering design: a practical guide. Trafford. p. 445. ISBN 978-1-4120-3850-8. https://books.google.com/books?id=M5BWtQ-xjeUC&pg=PA445.
- ↑ 13.0 13.1 13.2 13.3 13.4 13.5 Kaushish (2008). Manufacturing Processes. PHI Learning Pvt. Ltd.. p. 378. ISBN 978-81-203-3352-9. https://books.google.com/books?id=1ZOXXV9LdcwC&pg=PA378.
- ↑ 14.0 14.1 14.2 14.3 "Kapp GalvRepair". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/tin-zinc-lead-solder.php. Retrieved 23 October 2012.
- ↑ 15.0 15.1 15.2 15.3 15.4 15.5 Howard H. Manko (2001). Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. p. 164. ISBN 978-0-07-134417-3. https://books.google.com/books?id=MvSMg5HC1YcC&pg=PA164.
- ↑ 3439-00-577-7594 Solder, Tin Alloy. Tpub.com. Retrieved 2010-07-06.
- ↑ 17.0 17.1 17.2 17.3 17.4 17.5 Properties of Solders. farnell.com.
- ↑ 18.0 18.1 18.2 18.3 Pajky_vkladanylist_Cze_ang_2010.indd. (PDF). Retrieved 2010-07-06.
- ↑ "Balve Zinn Solder Sn63Pb37 – Balver Zinn". http://www.balverzinn.com/solder-Sn63Pb37.html?file=tl_files/balverzinn/downloads/datenblaetter_en/Solder%20Sn63Pb37.pdf. Retrieved 20 July 2016.
- ↑ "Balver Zinn Solder Sn63PbP". http://www.balverzinn.com/downloads/Solder_Sn63PbP.pdf. Retrieved 27 March 2018.
- ↑ "Safety Data Sheet". January 1, 2017. https://resource.bakerdist.com/is/content/Watscocom/Gemaire/amerway_sn50pb50_article_1456219847370_en_ss.pdf.
- ↑ 22.0 22.1 22.2 22.3 22.4 John H. Lau (1991). Solder joint reliability: theory and applications. Springer. p. 178. ISBN 978-0-442-00260-2. https://books.google.com/books?id=vMpHHWboSAAC&pg=PA178.
- ↑ "Indium Corp. Indalloy® 228 Pb-Sn-Ag Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=5ef2e290b637430483aab758ac193f3c. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 290 In-Ag Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=a8d11bdcc82c4410af96f5d43579d420. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 3 In-Ag Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=08d1a1dea82b4e13ac90e38eecb0b919. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 204 In-Pb Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=afcc8e122d334379a6d0d7d7079fc54d. Retrieved 20 July 2016.
- ↑ 27.0 27.1 27.2 27.3 Merrill L. Minges (1989). Electronic Materials Handbook: Packaging. ASM International. p. 758. ISBN 978-0-87170-285-2. https://books.google.com/books?id=c2YxCCaM9RIC&pg=PA758.
- ↑ "Indium Corp. Indalloy 1 Indium-Tin Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=718dfcb678cc42359978349a905862bc. Retrieved 20 July 2016.
- ↑ 29.0 29.1 29.2 29.3 29.4 29.5 29.6 29.7 Cite error: Invalid
<ref>tag; no text was provided for refs namedlowtemp - ↑ "Indium Corp. Indalloy 13 Indium Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=802ee7cd28ef4fd59cdc87d7e1fef98b. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 10 Pb-In Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=3cc5ca3fdb7848bda630047dd05bb6b3. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 9 Sn-Pb-In Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=5edfeb10d3c74d44967d0d605328c1e8. Retrieved 20 July 2016.
- ↑ "94.5Pb-5.5Ag Lead-Silver Solder, ASTM Class 5.5S; UNS L50180". http://www.matweb.com/search/DataSheet.aspx?MatGUID=0225ffa15e7e4a87a61bf164dc0f77e1. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 175 Lead Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=7a0646b6fbce4f79b2cee716edc3f66f. Retrieved 20 July 2016.
- ↑ 35.0 35.1 35.2 35.3 35.4 Symposium on Solder. ASTM International. 1957. p. 114. https://books.google.com/books?id=gW6zNhhy5ZQC&pg=PA114.
- ↑ "97.5Pb-2.5Ag Lead-Silver Solder, ASTM Class 2.5S UNS L50132". http://www.matweb.com/search/DataSheet.aspx?MatGUID=299122b40d9246bfa960a15e875d1464. Retrieved 20 July 2016.
- ↑ "Alloy Temperature Chart". Kester. https://www.kester.com/Portals/0/Documents/Knowledge%20Base/Alloy%20Temperature%20Chart.pdf.
- ↑ "Balver Zinn Solder SN97C (SnAg3.0Cu0.5)". http://www.balverzinn.com/tl_files/balverzinn/downloads/datenblaetter_en/Solder%20SN97C.pdf. Retrieved 27 March 2018.
- ↑ Karl Seelig (2017) New Pb-Free Solder Alloy for Demanding Applications. VP Technology, AIM Solder
- ↑ "Balver Zinn Solder SN96C (SnAg3,8Cu0,7)". http://www.balverzinn.com/downloads/Solder_SN96C.pdf. Retrieved 27 March 2018.
- ↑ "Indium Corp. Indalloy® 252 95.5Sn/3.9Ag/0.6Cu Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=a811b22a9ddd406d88a92130ebc9a9f0. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 246 95.5Sn/4.0Ag/0.5Cu Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=19662ece2a4a4bb2bbe7aa522f916185. Retrieved 20 July 2016.
- ↑ 43.0 43.1 43.2 Karl J. Puttlitz; Kathleen A. Stalter (2004). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. p. 541. ISBN 978-0-8247-4870-8. https://books.google.com/books?id=H75TywRXUK4C&pg=PA541.
- ↑ "Solder selection for photonic packaging". AIM Metals & Alloys. 27 February 2013. http://www.aimsolder.com/specialty-materials-division-solders-photonic-packing. Retrieved 20 August 2016.
- ↑ 45.0 45.1 45.2 45.3 45.4 45.5 "KappZapp". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/zapp-solder.php. Retrieved 25 October 2012.
- ↑ "KappZapp7". SolderDirect.com. http://www.solderdirect.com/all-products/non-aluminum-soldering/kappzapp/kappzapp7tm.html. Retrieved 25 October 2012.
- ↑ 47.0 47.1 Sanka Ganesan; Michael Pecht (2006). Lead-free electronics. Wiley. p. 404. ISBN 978-0-471-78617-7. https://books.google.com/books?id=z4Ha0AYdon4C&pg=PA110.
- ↑ Keith William Sweatman and Tetsuro Nishimura (January 2006). "The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-Free Solder". Nihon Superior Co., Ltd. http://www.aimsolder.com/sites/default/files/the_fluidity_of_the_ni-modified_sn-cu_eutectic_lead-free_solder_white_paper.pdf.
- ↑ SN100C® LEAD-FREE SOLDER ALLOY. aimsolder.com
- ↑ K100LD. kester.com
- ↑ SN100C® Technical Guide. floridacirtech.com
- ↑ "Balver Zinn Solder SCA (SnCu0.7Ag0.3)". http://www.balverzinn.com/downloads/Solder_SCA.pdf. Retrieved 27 March 2018.
- ↑ Balver Zinn Solder Sn97Cu3
- ↑ 54.0 54.1 54.2 54.3 54.4 Howard H. Manko (2001). Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. pp. 396–. ISBN 978-0-07-134417-3. https://books.google.com/books?id=MvSMg5HC1YcC&pg=PA396.
- ↑ 55.0 55.1 55.2 55.3 55.4 55.5 55.6 55.7 55.8 55.9 "KappAloy". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/tin-zinc-solder.php. Retrieved 23 October 2012.
- ↑ "Indium Corp. Indalloy® 249 91.8Sn/3.4Ag/4.8Bi Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=fbf7a599eb0e407981ed2f785bbe24ee. Retrieved 20 July 2016.
- ↑ Paul T. Vianco and Jerome A. Rejent (1994) "Tin-silver-bismuth solders for electronics assembly " U.S. Patent 5,439,639
- ↑ George P Luckey (1920) U.S. Patent 1,333,666
- ↑ Composition And Physical Properties Of Alloys . Csudh.edu (2007-08-18). Retrieved 2010-07-06.
- ↑ 60.0 60.1 60.2 60.3 Karl J. Puttlitz; Kathleen A. Stalter (2004). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. ISBN 978-0-8247-4870-8. https://books.google.com/books?id=H75TywRXUK4C&pg=PA21.
- ↑ "Indium Corp. Indalloy 226 Tin Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=64d8ba345b524cdc815a1df1dc7142b0. Retrieved 20 July 2016.
- ↑ Laurence G. Stevens and Charles E. T. White (1992) "Lead-free alloy containing tin, zinc and indium" U.S. Patent 5,242,658
- ↑ "Indium Corp. Indalloy® 231 Sn-Zn-In-Bi Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=67e162f8c187441a85e22ea1b98b52a0. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 254 86.9Sn/10.0In/3.1Ag Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=778b662660244af7b8d9689a007e8813. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 131 97Sn/3Sb Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=fc88a689e7ab481194cc1c5a1e2eb6a1. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 129 99Sn/1Sb Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=6b43308933eb48bba5f38c1217c73ce3. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 282 57Bi/42Sn/1Ag Lead-Free Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=3f9d5aa624ea454f81308048ab101817. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 281 Bi-Sn Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=967a4cd7871b46fa9128a29c303cf8be. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 67 Bismuth-Lead Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=4c19e3682c3b4d3198f3025b81cce73f. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 2 In-Pb-Ag Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=03e0734456b74c088b9f9c19f6af6ab9. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 532 Tin Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=fcd842de41fd4fcba9250418612914bf. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 150 Pb-In Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=d7525946b1a446afa73b5dd52997a283. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 87 Indium-Tin Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=aea1c42aa0a341aa948d7103c3a4564b. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 181 Sn-Pb-Cd Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=199da4a304e44104868eaf537a7c9a16. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy® 227 Sn-In-Ag Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=e2f902d610494ab7a7f500fcfbdb43cc. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 253 Indium Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=1fef3a2158ba400abe6f7e2a5c171ca1. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 18 Indium Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=4ccb81db2b7e4eb5a517409445b37deb. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 140 Bismuth Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=61beeec304154e14b711984757f073ed. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 147 Bismuth Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=bf336aff588c4e72acb714d5a4ae13c6. Retrieved 20 July 2016.
- ↑ "Indium Corp. Indalloy 21 Bismuth Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=5a48bcea477c4b2eb9153f5fc28243da. Retrieved 20 July 2016.
- ↑ Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead. Retrieved on February 6, 2015.
- ↑ "Indium Corp. Indalloy 22 Bismuth Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=82d47484509e4e81b53f487bed41a324. Retrieved 20 July 2016.
- ↑ "Chip Quik – SMD Removal Kit (Chip Quik Alloy 2.5ft, flux, alcohol pads) lead-free". http://www.chipquik.com/store/product_info.php?products_id=220001. Retrieved 20 July 2016.
- ↑ 84.0 84.1 "KappTec". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/tec-solder.php. Retrieved 23 October 2012.
- ↑ 85.0 85.1 85.2 85.3 Cite error: Invalid
<ref>tag; no text was provided for refs namedKapp Cad/Zinc - ↑ 86.0 86.1 "KappTecZ". Kapp Alloy & Wire, Inc.. http://www.kappalloy.com/tecz-solder.php. Retrieved 25 October 2012.
- ↑ 87.0 87.1 87.2 "KappRad". Kapp Alloy & Wire, Inc. http://www.kappalloy.com/kapprad-solder.php. Retrieved 25 October 2012.
- ↑ Soft Solders. www.cupalloys.co.uk (2009-01-20). Retrieved 2010-07-06.
- ↑ "Indium Corp. Indalloy® 238 Sn-Au Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=ec6a4e98e2294ead8788107da410c9d8. Retrieved 20 July 2016.
- ↑ 90.0 90.1 "Indium Corporation Global Solder Supplier Electronics Assembly Materials". http://www.indium.com/_dynamo/download.php?docid=298. Retrieved 27 March 2018.
- ↑ "Chip Scale Review Magazine". Chipscalereview.com. 2004-04-20. http://www.chipscalereview.com/issues/1004/article.php?type=feature&article=f3. Retrieved 2010-03-31.
- ↑ "High-Temperature Gold Solder & Braze Materials". Indium Corporation. http://www.indium.com/gold/files/2010/12/98217.pdf. Retrieved 27 March 2018.
- ↑ "Indium Corp. Indalloy 184 Gold Solder Alloy". http://www.matweb.com/search/DataSheet.aspx?MatGUID=ac3061509fca4befa1191973be39cd62. Retrieved 20 July 2016.
- ↑ T.Q. Collier (May–Jun 2008). "Choosing the best bumb for the buck". Advanced Packaging 17 (4): 24. ISSN 1065-0555. https://books.google.com/books?id=71tVjt0QUrEC&pg=PT27.
- ↑ M. Burda (2015). "Soldering of carbon materials using transition metal rich alloys". ACS Nano 9 (8): 8099–107. doi:10.1021/acsnano.5b02176. PMID 26256042.
- ↑ "Technical Data Sheet, Cametics C-Solder active soldering alloy". http://www.cametics.com/resources/upload/data%20sheets/Cametics%20C-SOLDER%20Technical%20data%20sheet%20-%20August%202016.pdf. Retrieved 27 March 2018.
- ↑ Nan Jiang (2019). "Reliability issues of lead-free solder joints in electronic devices". Science and Technology of Advanced Materials 20 (1): 876–901. doi:10.1080/14686996.2019.1640072. PMID 31528239. Bibcode: 2019STAdM..20..876J.
- ↑ "Thermal Properties of Metals, Conductivity, Thermal Expansion, Specific Heat – Engineers Edge". http://www.engineersedge.com/properties_of_metals.htm. Retrieved 20 July 2016.
- ↑ 99.0 99.1 99.2 "Database for Solder Properties with Emphasis on New Lead-free Solders". metallurgy.nist.gov. 2012-07-10. http://www.metallurgy.nist.gov/solder/NIST_LeadfreeSolder_v4.pdf. Retrieved 2013-06-08.
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