List Of Intel Core M Microprocessors

Intel Core M is a family of ultra low-voltage microprocessors belonging to the Intel Core series and designed specifically for ultra-thin notebooks, 2-in-1 detachables, and other mobile devices. The thermal design power (TDP) of all Core M microprocessors is 4.5 watts or lower. Intel Core M microprocessors are fanless due to their low TDP.

Broadwell microarchitecture (5th generation)

"Broadwell-Y" (SoC, dual-core, 14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
• All models except M-5Y10a and M-5Y70 support Configurable TDP.
• M-5Y70 and M-5Y71 also support Intel vPro.
• GPU and memory controller (up to 2 × DDR3-1600) are integrated onto the processor die.
• Peripherals include 12 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
• Package size: 30 mm × 16.5 mm
• Transistors: 1.3 billion
• Die size: 82 mm²

| Core M-5Y10 [1]

|

| 2 | 800 MHz | 2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 100–800 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | September 2014

|

| $281 |-

| Core M-5Y10a

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| 2 | 800 MHz | 2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 100–800 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | September 2014

|

| $281 |-

| Core M-5Y10c

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| 2 | 800 MHz | 2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–800 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

| $281 |-

| Core M-5Y31

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| 2 | 900 MHz | 2.4 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–850 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

| $281 |-

| Core M-5Y51

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| 2 | 1.1 GHz | 2.6 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–900 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

| $281 |-

| Core M-5Y70

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| 2 | 1.1 GHz | 2.6 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 100–850 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | September 2014

|

| $281 |-

| Core M-5Y71

|

| 2 | 1.2 GHz | 2.9 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–900 MHz

|

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

| $281 |-

|}

Skylake microarchitecture (6th generation)

"Skylake-Y" (SoC, dual-core, 14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
• m5-6Y57 and m7-6Y75 also support Intel vPro, Intel TXT.
• GPU and memory controller (up to 2 × DDR3-1866) are integrated onto the processor die.
• Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
• Package size: 20 mm × 16.5 mm
• Transistors: TBD
• Die size: TBD

| Core m3-6Y30

|

| 2 (4) | 900 MHz | 2.2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–850 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

| $281 |-

| Core m5-6Y54

|

| 2 (4) | 1.1 GHz | 2.7 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–900 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

| $281 |-

| Core m5-6Y57

|

| 2 (4) | 1.1 GHz | 2.8 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–900 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

| $281 |-

| Core m7-6Y75

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| 2 (4) | 1.2 GHz | 3.1 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–1000 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

| $393 |-

|}

Kaby Lake microarchitecture (7th/8th generation)

"Kaby Lake-Y" (SoC, dual-core, 14 nm)

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
• GPU and memory controller (up to 2 × LPDDR3-1866) are integrated onto the processor die.
• Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
• Package size: 20 mm × 16.5 mm
• Transistors: TBD
• Die size: TBD

| Core m3-7Y30

|

| 2 (4) | 1 GHz | 2.6 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 615 | 300–900 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2016

|

| $281 |-

| Core m3-7Y32

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| 2 (4) | 1.1 GHz | 3.0 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 615 | 300–900 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | April 2017

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| $281 |-

|}

"Amber Lake-Y" (dual-core, 14 nm)

| Core m3-8100Y

|

| 2 (4) | 1.1 GHz | 3.4 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 615 | 300–900 MHz

|

| BGA 1515 | DMI 3.0 | style="text-align:right;" | August 2018

|

| $281 |-

|}

See also

• System on a chip (SoC)

References

External links

• Intel Core M Processors Product Order Code Table
• Intel processor price list
• Intel 14nm technology

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